Patents by Inventor Raymond A. Krick

Raymond A. Krick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package-level backside metallization (BSM)
    Patent number: 11652061
    Abstract: Embodiments may relate to a microelectronic package that includes a die and a backside metallization (BSM) layer positioned on the face of the die. The BSM layer may include a feature that indicates that the BSM layer was formed on the face of the die by a masked deposition technique. Other embodiments may be described or claimed.
    Type: Grant
    Filed: June 17, 2019
    Date of Patent: May 16, 2023
    Assignee: Intel Corporation
    Inventors: Shenavia S. Howell, John J. Beatty, Raymond A. Krick, Suzana Prstic
  • PACKAGE-LEVEL BACKSIDE METALLIZATION (BSM)
    Publication number: 20200395307
    Abstract: Embodiments may relate to a microelectronic package that includes a die and a backside metallization (BSM) layer positioned on the face of the die. The BSM layer may include a feature that indicates that the BSM layer was formed on the face of the die by a masked deposition technique. Other embodiments may be described or claimed.
    Type: Application
    Filed: June 17, 2019
    Publication date: December 17, 2020
    Applicant: Intel Corporation
    Inventors: Shenavia S. Howell, John J. Beatty, Raymond A. Krick, Suzana Prstic
  • EMI containment for microprocessor core mounted on a card using surface mounted clips
    Patent number: 6239973
    Abstract: An electronic cartridge which includes a cover that is electrically coupled to a substrate by a clip. An integrated circuit package is mounted to the substrate and at least partially enclosed by the cover. The clips and cover may be connected to a ground plane of the substrate. The cover and substrate may create a “shield” about the integrated circuit package so that any electromagnetic field that flows from the package is grounded to the substrate.
    Type: Grant
    Filed: March 27, 2000
    Date of Patent: May 29, 2001
    Assignee: Intel Corporation
    Inventors: Scot W. Taylor, Robert Starkston, Charles Gealer, Michael L. Rutigliano, Raymond A. Krick, John A. Rabenius, Edmond L. Hart, Ravi V. Mahajan, Farukh Fares
  • EMI containment for microprocessor core mounted on a card using surface mounted clips
    Patent number: 6043983
    Abstract: An electronic cartridge which includes a cover that is electrically coupled to a substrate by a clip. An integrated circuit package is mounted to the substrate and at least partially enclosed by the cover. The clips and cover may be connected to a ground plane of the substrate. The cover and substrate may create a "shield" about the integrated circuit package so that any electro-magnetic field that flows from the package is grounded to the substrate.
    Type: Grant
    Filed: June 17, 1998
    Date of Patent: March 28, 2000
    Assignee: Intel Corporation
    Inventors: Scot W. Taylor, Robert Starkston, Charles Gealer, Michael L. Rutigliano, Raymond A. Krick, John A. Rabenius, Edmond L. Hart, Ravi V. Mahajan, Farukh Fares