Abstract: High-speed interconnects for printed circuit boards and methods for forming the high-speed interconnects are described. A high-speed interconnect may comprise a region of a conductive film having a reduced surface roughness and one or more regions that have been treated for improved bonding with an adjacent insulating layer. Regions of reduced roughness may be used to carry high data rate signals within PCBs. Regions treated for bonding may include a roughened surface, adhesion-promoting chemical treatment, and/or material deposited to improve wettability of the surface and/or adhesion to a cured insulator.

Abstract: High-speed interconnects for printed circuit boards and methods for forming the high-speed interconnects are described. A high-speed interconnect may comprise a region of a conductive film having a reduced surface roughness and one or more regions that have been treated for improved bonding with an adjacent insulating layer. Regions of reduced roughness may be used to carry high data rate signals within PCBs. Regions treated for bonding may include a roughened surface, adhesion-promoting chemical treatment, and/or material deposited to improve wettability of the surface and/or adhesion to a cured insulator.

Abstract: High-speed interconnects for printed circuit boards and methods for forming the high-speed interconnects are described. A high-speed interconnect may comprise a region of a conductive film having a reduced surface roughness and one or more regions that have been treated for improved bonding with an adjacent insulating layer. Regions of reduced roughness may be used to carry high data rate signals within PCBs. Regions treated for bonding may include a roughened surface, adhesion-promoting chemical treatment, and/or material deposited to improve wettability of the surface and/or adhesion to a cured insulator.

Abstract: High-speed interconnects for printed circuit boards and methods for forming the high-speed interconnects are described. A high-speed interconnect may comprise a region of a conductive film having a reduced surface roughness and one or more regions that have been treated for improved bonding with an adjacent insulating layer. Regions of reduced roughness may be used to carry high data rate signals within PCBs. Regions treated for bonding may include a roughened surface, adhesion-promoting chemical treatment, and/or material deposited to improve wettability of the surface and/or adhesion to a cured insulator.

Abstract: An insulation blowing machine is provided, comprising an upper section, comprising a hopper, an agitator, and an agitator motor coupled to drive the agitator; a base, comprising a blower, an airlock, and an airlock motor coupled to drive airlock paddles within the airlock; and a pivoting mechanism connecting the upper section with the base, whereby the upper section is tiltable on the pivoting mechanism away from the base to an open position without disassembly or disengagement of components in the upper section from components in the base to expose the airlock paddles within the airlock; whereby, in operation insulation fed into the hopper passes through an opening in the bottom of the hopper and into the airlock to be discharged through an outlet.

Abstract: A vacuum machine is provided, comprising: an engine secured to a frame and having an engine shaft; an impeller coupled to the engine shaft; a shroud surrounding the impeller and having an inlet and an outlet; a disk secured to the frame between the engine and the shroud, the disk having a plurality of spaced-apart notches around its perimeter; and a spring-loaded latch pin secured to the shroud and configured to engage one of the notches when in a first, locking position, and to disengage from the notch when in a pulled-back, unlocked position, thereby permitting the shroud to rotate about the impeller and lock in any of a plurality of positions corresponding to the plurality of notches.

Abstract: An insulation blowing machine is provided, comprising an upper section, comprising a hopper, an agitator, and an agitator motor coupled to drive the agitator; a base, comprising a blower, an airlock, and an airlock motor coupled to drive airlock paddles within the airlock; and a pivoting mechanism connecting the upper section with the base, whereby the upper section is tiltable on the pivoting mechanism away from the base to an open position without disassembly or disengagement of components in the upper section from components in the base to expose the airlock paddles within the airlock; whereby, in operation insulation fed into the hopper passes through an opening in the bottom of the hopper and into the airlock to be discharged through an outlet.

Abstract: A portable gauge and method are used to determine an as installed property of a loose-fill insulation in a building cavity wherein the cavity has a given depth, an open front, a rear surface, and sidewalls defined by spaced apart framing members. The gauge includes a frame for extending between and overlapping front surfaces of the framing members to position the gauge for determining an as installed property of the insulation; a plunger assembly mounted on the frame for compressing a portion of the insulation in the cavity to a compressed density sufficiently dense to prevent plunger creep and to a compressed thickness less than the as installed thickness of the insulation; and a readout assembly calibrated to indicate an as installed property of the insulation based on the compressed thickness of the insulation.