Abstract: A method for de-tabbing a dielectric tab extending between and bonded to first and second stainless steel portions of a disk drive head suspension component. Exemplary first and second stainless steel portions are a flexure base region and a flexure tongue. The method includes applying laser energy to the dielectric tab. The laser energy is characterized by one or more parameters, e.g., a pulse width and/or an energy density, causing de-bonding of the dielectric tab from the first and second stainless steel portions.

Abstract: A method of forming a flexure for an integrated lead head suspension with a metal spring layer, a conductive lead layer and an insulator layer between the metal spring layer and the conductive lead layer. The method includes forming insulator suspended portions on a lower surface of the conductive lead layer and further includes forming insulator spring arm portions on an upper surface of the metal spring layer adjacent to the insulator suspended portions.

Abstract: A flexure for an integrated lead head suspension comprising a metal spring layer having a metal base region, a metal head bonding platform, and one or more metal spring arms connecting the metal head bonding platform to the metal base region for flexure motion. The flexure also includes a conductive lead layer having lead base region portions extending over the metal base region and lead suspended portions spaced from and adjacent to at least one of the metal spring arms. The flexure further includes an insulator layer between the metal spring layer and the conductive lead layer that has insulator base region portions for bonding the lead base region portions to and insulating the lead base region portions from the metal base region. The insulator layer also has insulator suspended portions on a lower surface of the lead suspended portions and insulator spring arm portions on an upper surface of the metal spring arms adjacent to the lead suspended portions.

Abstract: An integrated lead suspension flexure including a metal spring layer having a metal base region, a metal head bonding platform, and one or more metal spring arms connecting the metal head bonding platform to the metal base region for flexure motion. The flexure also includes a conductive lead layer having a surface facing the metal spring layer and extending between the metal base region and the metal head bonding platform. The conductive lead layer has lead base region portions extending over the metal base region, lead metal-backed arm portions extending over the metal spring arms, and lead suspended portions extending from at least one of the lead metal-backed arm portions.