Patents by Inventor Raymond A. Phillips, Jr.

Raymond A. Phillips, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrical coupling of a stiffener to a chip carrier
    Patent number: 6699736
    Abstract: A method and structure for conductively coupling a metallic stiffener to a chip carrier. A substrate has a conductive pad on its surface and an adhesive layer is formed on the substrate surface. The metallic stiffener is placed on the adhesive layer, wherein the adhesive layer mechanically couples the stiffener to the substrate surface and electrically couples the stiffener to the pad. The adhesive layer is then cured such as by pressurization at elevated temperature. Embodiments of the present invention form the adhesive layer by forming an electrically conductive contact on the pad and setting a dry adhesive on the substrate, such that the electrically conductive contact is within a hole in the dry adhesive. The electrically conductive contact electrically couples the stiffener to the pad. The curing step includes curing both the dry adhesive and the electrically conductive contact, resulting in the dry adhesive adhesively coupling the stiffener to the substrate.
    Type: Grant
    Filed: November 26, 2002
    Date of Patent: March 2, 2004
    Assignee: International Business Machines Corporation
    Inventors: Terry J. Dornbos, Raymond A. Phillips, Jr., Mark V. Pierson, William J. Rudik, David L. Thomas
  • Electrical coupling of a stiffener to a chip carrier
    Patent number: 6534848
    Abstract: A method and structure for conductively coupling a metallic stiffener to a chip carrier. A substrate has a conductive pad on its surface and an adhesive layer is formed on the substrate surface. The metallic stiffener is placed on the adhesive layer, wherein the adhesive layer mechanically couples the stiffener to the substrate surface and electrically couples the stiffener to the pad. The adhesive layer is then cured such as by pressurization at elevated temperature. Embodiments of the present invention form the adhesive layer by forming an electrically conductive contact on the pad and setting a dry adhesive on the substrate, such that the electrically conductive contact is within a hole in the dry adhesive. The electrically conductive contact electrically couples the stiffener to the pad. The curing step includes curing both the dry adhesive and the electrically conductive contact, resulting in the dry adhesive adhesively coupling the stiffener to the substrate.
    Type: Grant
    Filed: September 7, 2000
    Date of Patent: March 18, 2003
    Assignee: International Business Machines Corporation
    Inventors: Terry J. Dornbos, Raymond A. Phillips, Jr., Mark V. Pierson, William J. Rudik, David L. Thomas
  • Built-in inspection template for a printed circuit
    Patent number: 6514777
    Abstract: An improved bonding strip for a printed circuit to facilitate quality inspection. The bonding strip has functional regions and non-functional regions. A functional region is indicated by an area of the bonding strip having a first dimension in width. A non-functional region is indicated by an area of the bonding strip having a second dimension in width. The first dimension may be either wider or narrower than the second dimension.
    Type: Grant
    Filed: January 10, 2001
    Date of Patent: February 4, 2003
    Assignee: International Business Machines Corporation
    Inventors: Marshall L. Brown, James A. Busby, Raymond A. Phillips, Jr., John A. Potenza, Jirina D. Shupp, J. Robert Young
  • Built-in inspection template for a printed circuit
    Patent number: 6212077
    Abstract: An improved bonding strip for a printed circuit to facilitate quality inspection. The bonding strip has functional regions and non-functional regions. A functional region is indicated by an area of the bonding strip having a first dimension in width. A non-functional region is indicated by an area of the bonding strip having a second dimension in width. The first dimension may be either wider or narrower than the second dimension.
    Type: Grant
    Filed: January 25, 1999
    Date of Patent: April 3, 2001
    Assignee: International Business Machines Corporation
    Inventors: Marshall L. Brown, James A. Busby, Raymond A. Phillips, Jr., John A. Potenza, Jirina D. Shupp, J. Robert Young
  • Method of improved cavity BGA circuit package
    Patent number: 6040631
    Abstract: An improved bonding system is provided in which a metal heat spreader is bonded to semiconductor chip. A two adhesive system is used in which a first adhesive demonstrates high bond strength with a second adhesive exhibits high thermal conductivity.
    Type: Grant
    Filed: January 27, 1999
    Date of Patent: March 21, 2000
    Assignee: International Business Machines Corporation
    Inventors: Eric P. Dibble, Eric A. Johnson, Raymond A. Phillips, Jr.