Abstract: A tube support for U-shaped tubes of a moisture separator reheater is disclosed. The tube supports in the proximity of U-bend of the U-shaped tubes being divided into an upper movable tube support member and a lower immovable tube support member, whereby the U-shaped tube members are permitted to expand without binding.

Abstract: This is an article and process which provide the first essentially continuous high tin flow soldering method for attaching copper based fins to copper based tubing. This invention avoids sludge buildup in the reservoir and generally avoids lead carbonate formation when the heat exchanger is in service. In addition, a novel structure is produced having a braze like joint with eta phase layers adjacent to the copper based surfaces. The invention utilizes an essentially lead free, high tin solder cascade onto a preferably cool tube, generally with a limited time of contact between the liquid solder and the tube, and with a combination air quench and wipe to remove excess solder and solidify the remaining solder. Thus a braze like joint is achieved having better heat conduction and closer thermal expansion match. This finned heat exchanger tubing is generally useful for liquid to gas type heat exchangers and especially useful for hydrogen coolers for electrical generators.