Abstract: A molding additive composition comprising a mixture of low profile additive and a surfactant additive containing a silicon-oxyalkylene copolymer flow control agent and surface modifying agent; and a molding composition comprising a polyester molding resin, a low profile additive, a silicon-oxyalkylene copolymer flow control agent and surface modifying agent and a crosslinking monomer. In another embodiment, the invention embraces a molding composition comprising a polyester molding resin, a crosslinking monomer, a low profile additive, a reinforcing fiber, and a silicon-oxyalkylene copolymer flow control agent and surface modifying agent.

Abstract: A molding composition is provided which, through the use of a lactone monomer, improves the surface characteristics of the molded composite. In particular, the use of .epsilon.-caprolactone (oxepane-2-one) provides a smoother surface and enhanced dimensional stability.

Abstract: Articles manufactured by bonding two or more shaped fiber reinforced polymeric substrates together can be made by an improved process comprising:applying a self-crosslinking acrylic polymer latex primer to the bonding surface of each of said substrates and allowing said primer to dry,applying an epoxy adhesive, in an amount sufficient to effect adhesion, to the bonding surfaces thus primed, andcontacting the bonding surfaces thus primed and epoxied with one another, under conditions sufficient to cure the epoxy, to achieve bonding.

Abstract: There is disclosed thickened, low shrink curable molding compositions having reduced initial viscosity and the method of making the same. The low shrink, curable thermosetting compositions have a thermoplastic low profile additive and viscosity reducing agent incorporated therein, said thermoplastic low profile additive being a vinyl acetate polymer, a saturated polyester or mixtures thereof and said viscosity reducing agent being an aliphatic monocarboxylic acid having at least 6 carbon atoms in the chain.