Abstract: A taping alignment tool for aligning tape on a printed circuit board having a set of finger connectors and two aligning holes adjacent the set of finger connectors, the taping alignment tool including a base having a first surface; a tape alignment and cutting member mounted on the first surface of the base and including a base leg for mounting the tape alignment and cutting member on the base, and an extension leg extending from the base leg in spaced relation above the first surface of the base, for forming a groove between the extension leg and the first surface of the base to receive the set of finger connectors of the printed circuit board therein, the extension leg having an exposed surface with a knife guide therein for guiding a knife to cut a tape applied on the printed circuit board and the extension leg in a pattern around the set of finger connectors, and the knife guide including stepped cut-away portions of the exposed surface of the extension leg for forming opposite side edge knife guides and

Abstract: Disclosed is a cleaning process for use primarily in the fabrication of printed circuit boards. Cleaning is done in-line with the coating and development of a photoresist layer. The process includes a spray cleaning and micro-etch, followed by the application of an anti-tarnish so that the boards can be stored prior to plating.

Abstract: A method for manufacturing a printed wiring board having a solder layer existing on circuit paths located on surfaces of the board and a solder layer on the walls of thru holes located in the board involves coating the surface of the board with a layer of photopolymer resist. A shield is placed over selected areas of the solder layer on the surface and the shielded surface is exposed to ultra violet light until the unshielded resist hardens. The shielded resist which has remained soft is removed and the board is washed with solder resist to remove the solder layer not covered by a coating of hardened resist.