Abstract: A method of forming a liquid lens, comprising the steps of: positioning a first substrate defining a hole over a second substrate, wherein a cavity is defined within the second substrate and aligned with the hole; dispensing a second liquid into the cavity defined within the second substrate; capping the second liquid with a first liquid dispensed through the hole, wherein the first liquid and the second liquid have different refractive indices than each other; and translating at least one of the first substrate and the second substrate such that the hole is not aligned with the cavity.

Abstract: A method of processing a substrate, with a first major surface of the substrate removably bonded to a first major surface of a first carrier and a second major surface of the substrate removably bonded to a first major surface of a second carrier, includes initiating debonding at a first location of an outer peripheral bonded interface between the substrate and the first carrier to separate a portion of the first carrier from the substrate. The method further includes propagating a first debond front from the first debonded location along a first direction extending away from the first debonded location by sequentially applying a plurality of lifting forces to the first carrier at a corresponding plurality of sequential lifting locations of the first carrier.

Abstract: A method of forming a liquid lens, comprising the steps of: positioning a first substrate defining a hole over a second substrate, wherein a cavity is defined within the second substrate and aligned with the hole; dispensing a second liquid into the cavity defined within the second substrate; capping the second liquid with a first liquid dispensed through the hole, wherein the first liquid and the second liquid have different refractive indices than each other; and translating at least one of the first substrate and the second substrate such that the hole is not aligned with the cavity.

Abstract: A method of processing a substrate, with a first major surface of the substrate removably bonded to a first major surface of a first carrier and a second major surface of the substrate removably bonded to a first major surface of a second carrier, includes initiating debonding at a first location of an outer peripheral bonded interface between the substrate and the first carrier to separate a portion of the first carrier from the substrate. The method further includes propagating a first debond front from the first debonded location along a first direction extending away from the first debonded location by sequentially applying a plurality of lifting forces to the first carrier at a corresponding plurality of sequential lifting locations of the first carrier.

Abstract: A print press system and a method are described herein that print an electronic circuit onto a material (e.g., glass substrate, plastic film, plastic film-glass substrate laminate). In exemplary applications, the print press system can print an electronic circuit onto a material to form, for instance, a flexible Liquid Crystal Display, a retail point of purchase sign and an e-book.

Abstract: Methods and apparatus for forming a semi-spherical polishing pad for polishing semiconductor surfaces, provide for: placing a polishing pad pre-form on a dome-shaped forming surface, the polishing pad pre-form including a circular body having a center and an outer peripheral edge, and a plurality of slots extending from the outer peripheral edge towards the center; disposing a bladder opposite to the dome-shaped forming surface and the polishing pad pre-form; inflating the bladder with a fluid such that the dome-shaped forming surface of the bonnet form presses against the polishing pad pre-form from one side and the bladder presses against the polishing pad pre-form from an opposite side; and maintaining the pressing step for a predetermined period of time to achieve the semi-spherical polishing pad.

Abstract: Methods and apparatus for forming a semi-spherical polishing pad for polishing semiconductor surfaces, provide for: placing a polishing pad pre-form on a dome-shaped forming surface, the polishing pad pre-form including a circular body having a center and an outer peripheral edge, and a plurality of slots extending from the outer peripheral edge towards the center; disposing a bladder opposite to the dome-shaped forming surface and the polishing pad pre-form; inflating the bladder with a fluid such that the dome-shaped forming surface of the bonnet form presses against the polishing pad pre-form from one side and the bladder presses against the polishing pad pre-form from an opposite side; and maintaining the pressing step for a predetermined period of time to achieve the semi-spherical polishing pad.

Abstract: Methods and apparatus for forming a semi-spherical polishing pad for polishing semiconductor surfaces, provide for: placing a polishing pad pre-form on a dome-shaped forming surface, the polishing pad pre-form including a circular body having a center and an outer peripheral edge, and a plurality of slots extending from the outer peripheral edge towards the center; disposing a bladder opposite to the dome-shaped forming surface and the polishing pad pre-form; inflating the bladder with a fluid such that the dome-shaped forming surface of the bonnet form presses against the polishing pad pre-form from one side and the bladder presses against the polishing pad pre-form from an opposite side; and maintaining the pressing step for a predetermined period of time to achieve the semi-spherical polishing pad.

Abstract: A method for screening abrasive wheels for fabricating a honeycomb extrusion die from a die body, and methods for fabricating a honeycomb extrusion die using an abrasive wheel assembly. One method for fabricating a honeycomb extrusion die includes measuring at least one of runout and thickness of each of a plurality of abrasive blades while rotating the blades, selecting a subset of the plurality of blades that have a measured runout or a measured thickness within a predetermined range, and mounting the subset of blades spaced from one another and concentrically aligned along a rotation axis of the abrasive wheel assembly.

Abstract: A method for screening abrasive wheels for fabricating a honeycomb extrusion die from a die body, and methods for fabricating a honeycomb extrusion die using an abrasive wheel assembly. One method for fabricating a honeycomb extrusion die includes measuring at least one of runout and thickness of each of a plurality of abrasive blades while rotating the blades, selecting a subset of the plurality of blades that have a measured runout or a measured thickness within a predetermined range, and mounting the subset of blades spaced from one another and concentrically aligned along a rotation axis of the abrasive wheel assembly.

Abstract: Methods and apparatus for forming a semi-spherical polishing pad for polishing semiconductor surfaces, provide for: placing a polishing pad pre-form on a dome-shaped forming surface, the polishing pad pre-form including a circular body having a center and an outer peripheral edge, and a plurality of slots extending from the outer peripheral edge towards the center; disposing a bladder opposite to the dome-shaped forming surface and the polishing pad pre-form; inflating the bladder with a fluid such that the dome-shaped forming surface of the bonnet form presses against the polishing pad pre-form from one side and the bladder presses against the polishing pad pre-form from an opposite side; and maintaining the pressing step for a predetermined period of time to achieve the semi-spherical polishing pad.

Abstract: Methods and apparatus for forming a semi-spherical polishing pad for polishing semiconductor surfaces, provide for: placing a polishing pad pre-form on a dome-shaped forming surface, the polishing pad pre-form including a circular body having a center and an outer peripheral edge, and a plurality of slots extending from the outer peripheral edge towards the center; disposing a bladder opposite to the dome-shaped forming surface and the polishing pad pre-form; inflating the bladder with a fluid such that the dome-shaped forming surface of the bonnet form presses against the polishing pad pre-form from one side and the bladder presses against the polishing pad pre-form from an opposite side; and maintaining the pressing step for a predetermined period of time to achieve the semi-spherical polishing pad.

Abstract: A print press system and a method are described herein that print an electronic circuit onto a material (e.g., glass substrate, plastic film, plastic film-glass substrate laminate). In exemplary applications, the print press system can print an electronic circuit onto a material to form, for instance, a flexible Liquid Crystal Display, a retail point of purchase sign and an e-book.

Abstract: Methods and apparatus for forming a semi-spherical polishing pad for polishing semiconductor surfaces, provide for: placing a polishing pad pre-form on a dome-shaped forming surface, the polishing pad pre-form including a circular body having a center and an outer peripheral edge, and a plurality of slots extending from the outer peripheral edge towards the center; disposing a bladder opposite to the dome-shaped forming surface and the polishing pad pre-form; inflating the bladder with a fluid such that the dome-shaped forming surface of the bonnet form presses against the polishing pad pre-form from one side and the bladder presses against the polishing pad pre-form from an opposite side; and maintaining the pressing step for a predetermined period of time to achieve the semi-spherical polishing pad.

Abstract: A bonding plate mechanism for use in anodic bonding of first and second material sheets together, the apparatus comprising: a base including first and second spaced apart surfaces; a thermal insulator supported by the second surface of the base and operable to impede heat transfer to the base; a heating disk directly or indirectly coupled to the insulator and operable to produce heat in response to electrical power; and a thermal spreader directly or indirectly coupled to the heating disk and operable to at least channel heat from the heating disk, and impart voltage, to the first material sheet, wherein the heat and voltage imparted to the first material sheet are in accordance with respective heating and voltage profiles to assist in the anodic bonding of the first and second material sheets, and a thermal inertia of the bonding plate mechanism is relatively low such that heating of the first material sheet to a temperature of about 600° C. or greater is achieved in less than about one-half hour.