Patents by Inventor Raymond Cirelli

Raymond Cirelli has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080001306
    Abstract: A method and apparatus for forming an electrically and/or thermally conducting interconnection is disclosed wherein a first surface and a second surface are contacted with each other via a plurality of nanostructures disposed on at least one of the surfaces. In one embodiment, a first plurality of areas of nanostructures is disposed on a component in an electronics package such as, illustratively, a microprocessor. The first plurality of areas is then brought into contact with a corresponding second plurality of areas of nanostructures on a substrate, thus creating a strong friction bond. In another illustrative embodiment, a plurality of nanostructures is disposed on a component, such as a microprocessor, which is then brought into contact with a substrate. Intermolecular forces result in an attraction between the molecules of the nanostructures and the molecules of the substrate, thus creating a bond between the nanostructures and the substrate.
    Type: Application
    Filed: September 10, 2007
    Publication date: January 3, 2008
    Applicant: Lucent Technologies Inc.
    Inventors: Nagesh Basavanhally, Raymond Cirelli, Omar Lopez
  • Publication number: 20060097252
    Abstract: The present invention provides an interconnect. The interconnect comprises a pliable surface having a plurality of nanostructures disposed thereon, the pliable surface configured to allow the plurality of nanostructures to at least partially conform to a surface when the nanostructures come into contact therewith.
    Type: Application
    Filed: December 20, 2005
    Publication date: May 11, 2006
    Applicant: Lucent Technologies Inc.
    Inventors: Nagesh Basavanhally, Raymond Cirelli, Omar Lopez
  • Publication number: 20050224975
    Abstract: A method and apparatus for forming an electrically and/or thermally conducting interconnection is disclosed wherein a first surface and a second surface are contacted with each other via a plurality of nanostructures disposed on at least one of the surfaces. In one embodiment, a first plurality of areas of nanostructures is disposed on a component in an electronics package such as, illustratively, a microprocessor. The first plurality of areas is then brought into contact with a corresponding second plurality of areas of nanostructures on a substrate, thus creating a strong friction bond. In another illustrative embodiment, a plurality of nanostructures is disposed on a component, such as a microprocessor, which is then brought into contact with a substrate. Intermolecular forces result in an attraction between the molecules of the nanostructures and the molecules of the substrate, thus creating a bond between the nanostructures and the substrate.
    Type: Application
    Filed: April 1, 2004
    Publication date: October 13, 2005
    Inventors: Nagesh Basavanhally, Raymond Cirelli, Omar Lopez