Abstract: A surface mount component adapter, assembly and related method for attaching a surface mount component to a printed circuit board. The surface mount component adapter includes a substrate, a surface mount component holder on the substrate, and flexible leads each having a base end attached to the surface mount component holder and a free end configured to engage a plated through hole on a circuit board. The surface mount component holder is configured to engage electrical contacts of a surface mount component. The surface mount component assembly combines the surface mount adapter with the surface mount component. In the surface mount component method, the surface mount assembly is formed and the free ends of the flexible leads are attached to a corresponding number of the plated through holes on the circuit board.

Abstract: A surface mount component adapter, assembly and related method for attaching a surface mount component to a printed circuit board. The surface mount component adapter includes a substrate, a surface mount component holder on the substrate, and flexible leads each having a base end attached to the surface mount component holder and a free end configured to engage a plated through hole on a circuit board. The surface mount component holder is configured to engage electrical contacts of a surface mount component. The surface mount component assembly combines the surface mount adapter with the surface mount component. In the surface mount component method, the surface mount assembly is formed and the free ends of the flexible leads are attached to a corresponding number of the plated through holes on the circuit board.

Abstract: A cryocooled field-replaceable logic unit for use with a cryogenic cold head such as that of a cryocooler comprises a thermally conductive plate adapted to be disposed in thermal contact with the cold head, a thermally insulating enclosure portion cooperating with the conductive plate to form a sealed enclosure detachable from the cold head, and one or logic chips mounted in the enclosure in thermal contact with the conductive plate. Preferably the conductive plate is attached to the thermally insulating portion through a resilient mounting which forms a recess for receiving the cold head and which is tension-loaded when the logic unit is mounted on the cold head to urge the plate into intimate thermal contact with the cold head. In one embodiment the enclosure receives from an external source a supply of gaseous nitrogen which is liquified by contact with the conductive plate to form a pool of liquid nitrogen in which the logic chips are immersed.