Patents by Inventor Raymond D. O'Dean

Raymond D. O'Dean has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making a packaged IC chip
    Patent number: 4820658
    Abstract: A lead frame for use with an integrated circuit chip comprises a plurality of lead frame segments, each segment comprising a plurality of leads the inner ends of which converge towards a pad area for the chip encircled by the segments.
    Type: Grant
    Filed: May 23, 1988
    Date of Patent: April 11, 1989
    Assignee: GTE Products Corporation
    Inventors: Thomas G. Gilder, Jr., Raymond D. O'Dean
  • Packaged integrated circuit chip
    Patent number: 4663650
    Abstract: An IC chip package comprises a lead frame support on which lead frame segments are disposed. An IC chip is disposed on a pad area on the lead frame support. There is a cover on the support. A sealant material encircles the IC chip within the confines of the support and cover in order to seal the IC chip from the environment.
    Type: Grant
    Filed: September 22, 1986
    Date of Patent: May 5, 1987
    Assignee: GTE Products Corporation
    Inventors: Thomas G. Gilder, Jr., Raymond D. O'Dean
  • Segmented lead frame strip for IC chip carrier
    Patent number: 4663651
    Abstract: A lead frame for use with an integrated circuit chip comprises a plurality of lead frame segments, each segment comprising a plurality of leads the inner ends of which converge towards a pad area for the chip encircled by the segments.
    Type: Grant
    Filed: September 22, 1986
    Date of Patent: May 5, 1987
    Assignee: GTE Products Corporation
    Inventors: Thomas G. Gilder, Jr., Raymond D. O'Dean
  • Method of making packaged IC chip
    Patent number: 4653174
    Abstract: In the manufacture of a packaged IC chip, a lead frame segment has a plurality of leads, the ends of which are connected to opposing rails. After the leads are secured to a lead frame support, the rails are removed and an IC chip is then connected. The chip and lead frame are then encapsulated between the support and a cover.
    Type: Grant
    Filed: January 27, 1986
    Date of Patent: March 31, 1987
    Assignee: GTE Products Corporation
    Inventors: Thomas G. Gilder, Jr., Raymond D. O'Dean
  • IC package sealing technique
    Patent number: 4629824
    Abstract: An IC package with an improved seal includes a sealant penetrator in the form of a projection on each lead for penetrating the provided seal. In a preferred embodiment the penetrator is a semi-circular projection formed on the lead which penetrates the sealant material.
    Type: Grant
    Filed: December 24, 1984
    Date of Patent: December 16, 1986
    Assignee: GTE Products Corporation
    Inventors: Thomas G. Gilder, Jr., Raymond D. O'Dean
  • Support for lead frame for IC chip carrier
    Patent number: 4554404
    Abstract: A support for a lead frame for use with an integrated circuit chip is made of electrically insulative material, preferably a thermoplastic. There is a pad area at the center of the support in which an IC chip can be disposed. Proximate the periphery of the pad are raised spaced-apart projections. The spaces between the projections define slots in which the leads of a lead frame can be disposed.
    Type: Grant
    Filed: March 26, 1984
    Date of Patent: November 19, 1985
    Assignee: Gte Products Corporation
    Inventors: Thomas G. Gilder, Jr., Raymond D. O'Dean