Patents by Inventor Raymond F. Bis

Raymond F. Bis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10815405
    Abstract: A one-component epoxy-modified polyurethane and/or urea adhesive includes very high levels of reactive urethane group- and/or urea group-containing tougheners, an epoxy resin and epoxy hardener. These adhesives are formulated to cure at high temperatures and surprisingly provide high elongations, excellent thermal stability and good adhesive properties.
    Type: Grant
    Filed: January 9, 2017
    Date of Patent: October 27, 2020
    Assignee: DOW GLOBAL TECHNOLOGIES LLC
    Inventors: Benjamin Haag, Andreas Lutz, Cathy Grossnickel, Raymond F. Bis
  • Publication number: 20190010373
    Abstract: A one-component epoxy-modified polyurethane and/or urea adhesive includes very high levels of reactive urethane group- and/or urea group-containing tougheners, an epoxy resin and epoxy hardener. These adhesives are formulated to cure at high temperatures and surprisingly provide high elongations, excellent thermal stability and good adhesive properties.
    Type: Application
    Filed: January 9, 2017
    Publication date: January 10, 2019
    Inventors: Benjamin Haag, Andreas Lutz, Cathy Grossnickel, Raymond F. Bis
  • Publication number: 20100028651
    Abstract: Expanded, toughened structural adhesives form stiffening materials for vehicular panels and bodyshell structures. The toughened structural adhesive contains an epoxy resin, a rubber, an elastomeric toughener, a curing agent, and an expanding agent. The expanded structural adhesive greatly increases the amount of energy absorbed by the panel or bodyshell structure during an impact. A blowing agent combination of a chemical blowing agent with expandable microballoons provides for especially good energy absorption.
    Type: Application
    Filed: July 28, 2009
    Publication date: February 4, 2010
    Inventors: Michael R. Golden, Raymond F. Bis, Mansour Mirdamadi, Jay M. Tudor