Patents by Inventor Raymond F. Frizzell
Raymond F. Frizzell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8424201Abstract: Disclosed are an electronic component, an assembly of an electronic component and an electronic carrier substrate, and a method of connecting the electronic component to the carrier substrate. The carrier substrate has a first coefficient of thermal expansion (CTE), and the electronic component has a second CTE. The assembly further comprises a conductive material on the carrier substrate for connecting the electronic component to the carrier substrate, and the electrical component is connected to the carrier substrate by heating and then cooling this conductive material. The electronic component includes an expansion joint to allow the electronic component to expand and contract relative to the carrier substrate during the heating and cooling of the conductive material.Type: GrantFiled: July 6, 2010Date of Patent: April 23, 2013Assignee: International Business Machines CorporationInventors: Michael J. Domitrovits, Edward J. Donnelly, Raymond F. Frizzell, Jr.
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Publication number: 20100269334Abstract: Disclosed are an electronic component, an assembly of an electronic component and an electronic carrier substrate, and a method of connecting the electronic component to the carrier substrate. The carrier substrate has a first coefficient of thermal expansion (CTE), and the electronic component has a second CTE. The assembly further comprises a conductive material on the carrier substrate for connecting the electronic component to the carrier substrate, and the electrical component is connected to the carrier substrate by heating and then cooling this conductive material. The electronic component includes an expansion joint to allow the electronic component to expand and contract relative to the carrier substrate during the heating and cooling of the conductive material.Type: ApplicationFiled: July 6, 2010Publication date: October 28, 2010Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Michael J. Domitrovits, Edward J. Donnelly, Raymond F. Frizzell, JR.
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Patent number: 7791892Abstract: Disclosed are an electronic component, an assembly of an electronic component and an electronic carrier substrate, and a method of connecting the electronic component to the carrier substrate. The carrier substrate has a first coefficient of thermal expansion (CTE), and the electronic component has a second CTE. The assembly further comprises a conductive material on the carrier substrate for connecting the electronic component to the carrier substrate, and the electrical component is connected to the carrier substrate by heating and then cooling this conductive material. The electronic component includes an expansion joint to allow the electronic component to expand and contract relative to the carrier substrate during the heating and cooling of the conductive material.Type: GrantFiled: January 31, 2007Date of Patent: September 7, 2010Assignee: International Business Machines CorporationInventors: Michael J. Domitrovits, Edward J. Donnelly, Raymond F. Frizzell, Jr.
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Publication number: 20090111299Abstract: A connector and method for making wherein the connector has a connector body, connector leads extending from the connector body for solder connection to an electronic circuit wherein the connector leads do not extend a uniform distance from the body connector body. A solder paste is formed on each connector lead by stenciling it onto a flat plate that is non-wettable to the solder paste. The solder paste is composed of first solder particles having a first lower melting point and second solder particles having a second higher melting point. The solder paste is heated to the first melting point for adhering the solder paste to the connector leads while planarizing the solder covered electrical leads with the flat plate. The connector leads are soldered to an electrical circuit by removing the flat plate and heating the solder paste to the second higher melting point.Type: ApplicationFiled: October 31, 2007Publication date: April 30, 2009Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Michael J. Domitrovits, Raymond F. Frizzell, JR., Wai Mon Ma, Cheikhou O. Ndiaye, Nandakumar N. Ranadive
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Patent number: 7503110Abstract: A method is provided for removing a component from a medium. The method includes applying an adhesive to a portion of a component. An attachment member is inserted into the portion of the component. The attachment member is pulled with a pulling element in a direction opposite a medium in which the component is inserted.Type: GrantFiled: January 24, 2007Date of Patent: March 17, 2009Assignee: International Business Machines CorporationInventors: Michael J. Domitrovits, Raymond F. Frizzell, Jr., Francis R. Krug
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Patent number: 7500886Abstract: An electronic assembly is provided that that includes a printed circuit board, an electrical connector attached to the printed circuit board, and a wire. A first end of the wire is attached to a signal pathway of one of the wafer modules of the electrical connector so as to electrically connect the wire and the signal pathway. The wire passes through a through-hole on the printed circuit board that corresponds to the signal pathway, and a second end of the wire is electrically connected to the printed circuit board or another of the wafer modules of the electrical connector.Type: GrantFiled: March 14, 2008Date of Patent: March 10, 2009Assignee: International Business Machines CorporationInventors: Raymond F. Frizzell, Jr., Arch F. Nuttall
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Publication number: 20080214026Abstract: An electronic assembly is provided that that includes a printed circuit board, an electrical connector attached to the printed circuit board, and a wire. A first end of the wire is attached to a signal pathway of one of the wafer modules of the electrical connector so as to electrically connect the wire and the signal pathway. The wire passes through a through-hole on the printed circuit board that corresponds to the signal pathway, and a second end of the wire is electrically connected to the printed circuit board or another of the wafer modules of the electrical connector.Type: ApplicationFiled: March 14, 2008Publication date: September 4, 2008Applicant: International Business Machines Corp.Inventors: RAYMOND F. FRIZZELL, JR., Arch F. Nuttall
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Publication number: 20080180900Abstract: Disclosed are an electronic component, an assembly of an electronic component and an electronic carrier substrate, and a method of connecting the electronic component to the carrier substrate. The carrier substrate has a first coefficient of thermal expansion (CTE), and the electronic component has a second CTE. The assembly further comprises a conductive material on the carrier substrate for connecting the electronic component to the carrier substrate, and the electrical component is connected to the carrier substrate by heating and then cooling this conductive material. The electronic component includes an expansion joint to allow the electronic component to expand and contract relative to the carrier substrate during the heating and cooling of the conductive material.Type: ApplicationFiled: January 31, 2007Publication date: July 31, 2008Applicant: International Business Machines CorporationInventors: Michael J Domitrovits, Edward J. Donnelly, Raymond F. Frizzell
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Publication number: 20080172853Abstract: A method and apparatus are provided for removing a component from a medium, where the apparatus includes an attachment member insertable into a portion of a component, an amount of adhesive for adhering the attachment member to the component, and a pulling element. The method includes pulling, with the pulling element, the attachment member in a direction opposite a medium in which the component is inserted.Type: ApplicationFiled: January 24, 2007Publication date: July 24, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Michael J. Domitrovits, Raymond F. Frizzell, Francis R. Krug
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Patent number: 7351115Abstract: A method is provided for modifying an electrical connector that is attached to a printed circuit board. On a wafer module of the electrical connector, a covering material is removed from an attachment area that is located above a signal pathway, and there is removed a connector pin that is connected to the signal pathway. A first end of a wire is attached to the attachment area of the wafer module to electrically connect to the signal pathway. The wire is run through a corresponding through-hole on the printed circuit board and the wafer module is inserted into an empty slot on the electrical connector. A second end of the wire is electrically connected to the printed circuit board or another wafer module. Also provided is an electronic assembly having a wire having a first end attached to a signal pathway of a wafer module of an electrical connector and a second end connected to a printed circuit board or another wafer module.Type: GrantFiled: January 17, 2007Date of Patent: April 1, 2008Assignee: International Business Machines CorporationInventors: Raymond F. Frizzell, Jr., Arch F. Nuttall