Abstract: An image processing system and method are used to ascertain the position of lead frame beams on a semiconductor lead frame prior to the formation of wire bonds to those lead frame beams. The lead frame beams are illuminated by a light source and light reflected from the lead frame beams is detected. Digital data representative of the reflected light is generated and stored in a memory. A control means defines corridors in that memory which are analyzed to define the position of the lead frame beams and to distinguish light reflected from the lead frame beams themselves from light reflected from interlead ceramic or glasslike material.

Abstract: A system and method for determining the condition and location of an electronic die on a die holding means is disclosed. The system includes means for illuminating the die and means for generating a video image in which the appearance of the die is enhanced relative to the die holding means. This is accomplished by providing a sensing means for sensing primarily only that light reflected from the candidate die. Means for converting the video image into a digital image and processing said digital image to identify the edges of the die is also disclosed. More particularly, means for generating digital data representing the video image, means for defining a corridor in said digital image, said corridor having a width and a length, and means for processing the digital image to obtain a signature element within the digital data are provided.