Abstract: A method of forming metallization patterns on a block of dielectric material wherein the entire surface area of the dielectric block is encased with a conductive material and unwanted conductive metal is ablatively etched from a designated surface area of the dielectric block to form desired metallized circuit patterns.

Abstract: A cost-effective communication filter is prepared by etching the surfaces of a shaped and fired ceramic core, applying an electroless nickel solution to create a nickel layer of limited thickness, electroplating the nickel plated core with a silver layer, patterning the nickel and silver plated core by removing metallization from selected surface areas and then heating the patterned filter block to bond the metal layers. The resulting filters comprise a rigid dielectric core defining a plurality of through-hole passages extending between opposing sides of the core. Present on the core is a pattern of metallized and unmetallized regions wherein the metallized regions of the pattern include an inner layer of nickel and an outer silver-containing layer.

Abstract: A cost-effective communication filter is prepared by etching the surfaces of a shaped and fired ceramic core, applying an electroless nickel solution to create a nickel layer of limited thickness, electroplating the nickel plated core with a silver layer, patterning the nickel and silver plated core by removing metallization from selected surface areas and then heating the patterned filter block to bond the metal layers. The resulting filters comprise a rigid dielectric core defining a plurality of through-hole passages extending between opposing sides of the core. Present on the core is a pattern of metallized and unmetallized regions wherein the metallized regions of the pattern include an inner layer of nickel and an outer silver-containing layer.

Abstract: A method of forming metallization patterns on a block of dielectric material wherein the entire surface area of the dielectric block is encased with a conductive material and unwanted conductive metal is ablatively etched from a designated surface area of the dielectric block to form desired metallized circuit patterns. The invention also comprises a filter and a duplexer formed by the method of the present invention.

Abstract: A method of forming metallization patterns on a block of dielectric material wherein the entire surface area of the dielectric block is encased with a conductive material and unwanted conductive metal is ablatively etched from a designated surface area of the dielectric block to form desired metallized circuit patterns.

Abstract: A ceramic filter (200), having: a filter body; and wrap-around input-output pads (210) with a metallized notch (218) connecting different planes of the wrap-around input-output pads (210). In a preferred embodiment, additional notches (238,240) can be included to minimize the possibility of disconnects on other adjacent surfaces of the ceramic filter (200).