Abstract: A brush conditioner for a semiconductor wafer cleaning tool including a pair if opposed, rotating flexible brushes. The conditioner is a wing-like structure having a leading edge and a trailing edge. The leading edge is forced against the rotating brushes flexing them to assist in removal of foreign material. The trailing edge tapers to a point and provides stability to the wing.

Abstract: Disclosed is a brush conditioning apparatus for attachment to a wafer cleaning tool having a cylindrical brush. The brush conditioning apparatus includes a freely rotatable, cylindrically shaped brush conditioner that can be adjustably mounted onto an existing wafer cleaning tool. The apparatus also includes a fluid injection system that has an intake port on at least one end of the cylindrical brush conditioner and includes fluid dispensing outlets along the radial surface of the brush conditioner. Because the brush conditioner is freely mounted onto the brush cleaning tool and in contact with the cleaning brush, a counter rotation of the brush conditioner will occur as the cleaning brush is rotated.