Abstract: In order to remove heat from integrated circuit modules a layered aluminum heat transfer structure is secured to the upper portion of a circuit board. The heat transfer structure includes a number of heat pipes for transferring heat to a condenser region. Each heat pipe is composed of a central vapor channel with a number of parallel capillary channels, each of which is open on one side to the vapor channel thereby serving as the wick of the heat pipe, running the length of the circuit board to a condenser region. There is one heat pipe for each row of integrated circuit modules wherein the modules are placed on the upper portion of the heat transfer structure and secured by means of terminal pins that run through the structure to the circuit board. The heat from the circuit modules vaporizes a working fluid in the capillaries and the vapor, in turn, travels in the vapor channel to a condenser region to be cooled and condensed by a cooling medium over this region.