Abstract: In methods of and apparatus (28) for indexing a repetitively patterned strip (12) past a plurality of work stations, such as, for example, a bonding station (33) and a dewebbing station (65) of a lead frame bonder, a cyclical, automated adjustment of the strip (12) with respect to the bonding station (33) eliminates repeated meticulous manual fine adjustments of the strip. An adjustment of the position of the strip (12) is achieved by adjusting the positions of travel limit stops (109 and 111) of an incremental feed mechanism (46). Simultaneously with the adjustment of the travel limit stops (109 and 111), an adjustment is made in the same magnitude and in the same direction as the adjustment to the limit stops in the position of the dewebbing station (65). Similar adjustments may be made to any other station, an accurate position of which with respect to the position of the strip (12) is desirable.

Abstract: A hybrid integrated circuit package (11) typically includes a circuit substrate or article (12) on which are formed thin film components (17, 18, 19) of a circuit (22) and to which is bonded at least one semiconductor chip (21). Prior to bonding the chip (21) to the article (12) the circuit (22) undergoes various tests and adjustment operations. An electric element, preferably a resistance element (36), is formed on the article (12). The element (36) is functionally independent of the circuit (22) on the article (12). A first, initial value of the element (36) marks the article (12) as belonging to a first group of articles having first circuit characteristics. The initial value of the element (36) is selectively altered to a second value upon a determination that the article (12) has circuit characteristics other than those of the first group. In the described preferred embodiment the first group is a group of electrically acceptable articles (12), while other characteristics are those of defective articles.

Abstract: Articles (12) are loaded onto a movable article holder such as pedestals (18) mounted to a rotary table (20). The table is indexed to advance the articles (12) first to a centering station (41) and then to a work station (49) which may be, for example, a lead frame bonder. At the centering station (41) a typical centering mechanism (22) urges the articles to a predetermined center location. While the centering mechanism may be adjusted to and fixedly located in a position to center the articles (12) to a theoretical center removed by precisely one step or a multiple thereof from the bonding position, the centering station (41) provides for tangentially shifting the theoretical center with respect to the table (20). Any shift of said theoretical center is made to offset an anticipated error of alignment of the articles, even though such error may be unique to each of the pedestal positions.

Abstract: A Hybrid Integrated Circuit package (11) typically includes a circuit substrate or article (12) on which are formed thin film components (17, 18, 19) of a circuit (22) and to which is bonded at least one semiconductor chip (21). Prior to bonding the chip (21) to the article (12) the circuit (22) undergoes various tests and adjustment operations. An electric element, preferably a resistance element (36), is formed on the article (12). The element (36) is functionally independent of the circuit (22) on the article (12). A first, initial value of the element (36) marks the article (12) as belonging to a first group of articles having first circuit characteristics. The initial value of the element (36) is selectively altered to a second value upon a determination that the article (12) has circuit characteristics other than those of the first group. In the described preferred embodiment the first group is a group of electrically acceptable articles (12), while other characteristics are those of defective articles.

Abstract: A bonder for attaching in succession small articles such as electronic devices to substrates has eight stations located along the path of a rotary member. The rotary member supports eight holders for substrates which are moved in sequence from station to station. At a first station a substrate is loaded onto one of the holders. The holder is then moved to an alignment station and transferred from the support member to a planar manipulator. An optical alignment control system recognizes a position of the substrate on the holder and controls the manipulation of the holder to align a substrate to a predetermined reference axis. The holder is then transferred back to the support member to fix the position of the substrate with respect to the support member. At the next station an article is also aligned to a corresponding reference axis and then tack-bonded or preliminarily attached to a bond site on the substrate.