Abstract: Disclosed are thermoplastic resin compositions having improved heat resistance, e.g., IR soldering and HDT; increased ductility and flowability; and reduced flash. In particular, the thermoplastic resin compositions have at least one high heat amorphous resin, at least one polysulfide; and, optionally, at least one reinforcing filler and/or at least one polyolefin and/or at least one polyolefin compound and/or at least one polyepoxy compound. The high heat amorphous resin is preferably a polyetherimide and the polyolefin is preferably a high crystalline polyethylene. The compositions of the invention are particularly well suited for preparing no flash high heat electrical connectors.

Abstract: Disclosed are thermoplastic resin compositions having improved heat resistance, e.g., IR soldering and HDT; increased ductility and flowability; and reduced flash. In particular, the thermoplastic resin compositions have at least one high heat amorphous resin, at least one polysulfide; and, optionally, at least one reinforcing filler and/or at least one polyolefin. The high heat amorphous resin is preferably a polyetherimide and the polyolefin is preferably a high crystalline polyethylene. The compositions of the invention are particularly well suited for preparing no flash high heat electrical connectors.

Abstract: Blends of polyester-carbonates and/or polyarylate resins with polyetherimide resins are thermoplastically molded to obtain ductile, high distortion temperature articles. The polyester-carbonate resin or polyarylate resin is selected from a particular class prepared by polymerization of a dihydric phenol, and an ester precursor which is terephthalic acid, optionally with a proportion of isophthalic acid.