Abstract: A two piece, metal and plastic, retaining ring used for chemical mechanical polishing of semiconductor substrates. In one embodiment, the plastic is selected from polyphenylene sulfide (PPS), polyethylene terephthalate, polyetheretherketone, polybutylene terephthalate, Ertalyte TX, PEEK, Torlon, Delrin, PET, Vespel, or Duratrol, and the plastic is assembled to a stainless steel ring with a urethane adhesive at room temperature. In another embodiment, the plastic is assembled to the metal portion with an acrylic adhesive at room temperature.

Abstract: A two piece retaining ring used for chemical mechanical polishing of semiconductor substrates. The two pieces of the ring are secured to each other by means of a central thread on the first piece and a mating thread on the second piece.

Abstract: A test array is mountable on a test fixture having a set of test fixture sockets. Each of the test fixture sockets is configured to receive a device under test. The test array comprises a first heat sink having a position on the test array that corresponds to a first socket of the set. The test array also comprises a second heat sink having a position on the test array that corresponds to a second socket of the set. The test array further comprises a first set of heat sinks having a first heat sink height and a second set of heat sinks having a second heat sink height such that the difference in the heights compensates for differences in the warpage of the test fixture between the location of the first and second set of heat sinks.