Abstract: The present invention relates to a method and apparatus that prevents/minimizes cracking in the ceramic body of processors. The ability to prevent/minimize cracking can ensure successful operation and substantially increase processor lifetime. The present invention discloses a device for maintaining a microprocessor in a desired relationship with a printed wiring board while limiting the transmission of shock and vibrational motion to and from the processor includes a printed wiring board, a processor, and a dynamic isolating mount compressed between the printed wiring board and the processor, wherein the processor maintains the dynamic isolating mount in a compressed state such that the dynamic isolating mount bears on the printed wiring board.

Abstract: A self-locking interposer restraint mechanism is disclosed. Rather than using screws to compress springs, clips are pushed down over the posts to compress the springs. Once the clips are pushed down to a level at which the springs are sufficiently compressed, the clips engage stops fabricated into the posts thereby locking the restraint mechanism.

Abstract: The present invention relates to a method and apparatus that prevents/minimizes cracking in the ceramic body of processors. The ability to prevent/minimize cracking can ensure successful operation and substantially increase processor lifetime. The present invention discloses a device for maintaining a microprocessor in a desired relationship with a printed wiring board while limiting the transmission of shock and vibrational motion to and from the processor includes a printed wiring board, a processor, and a dynamic isolating mount compressed between the printed wiring board and the processor, wherein the processor maintains the dynamic isolating mount in a compressed state such that the dynamic isolating mount bears on the printed wiring board.

Abstract: The present invention relates to a method and apparatus that prevents/minimizes cracking in the ceramic body of processors. The ability to prevent/minimize cracking can ensure successful operation and substantially increase processor lifetime. The present invention discloses a device for maintaining a microprocessor in a desired relationship with a printed wiring board while limiting the transmission of shock and vibrational motion to and from the processor includes a printed wiring board, a processor, and a dynamic isolating mount compressed between the printed wiring board and the processor, wherein the processor maintains the dynamic isolating mount in a compressed state such that the dynamic isolating mount bears on the printed wiring board.

Abstract: The present invention relates to a method and apparatus that minimizes shock/vibrational motion in interposer sockets. The ability to control shock/vibration can ensure successful operation and substantially increase socket lifetime. The present invention discloses a device for maintaining a heat sink in a desired relationship to a mounting base while limiting the transmission of shock and vibrational motion to and from the heat sink includes a fastener extending from the mounting base, a spring compressed between the fastener and the heat sink, and a damper compressed between the fastener and the sink wherein the fastener maintains the spring and the damper in a compressed state such that the spring and the damper bear on said heat sink.

Abstract: A self-locking interposer restraint mechanism is disclosed. Rather than using screws to compress springs, clips are pushed down over the posts to compress the springs. Once the clips are pushed down to a level at which the springs are sufficiently compressed, the clips engage stops fabricated into the posts thereby locking the restraint mechanism.

Abstract: The present invention relates to a method and apparatus that prevents/minimizes cracking in the ceramic body of processors. The ability to prevent/minimize cracking can ensure successful operation and substantially increase processor lifetime. The present invention discloses a device for maintaining a microprocessor in a desired relationship with a printed wiring board while limiting the transmission of shock and vibrational motion to and from the processor includes a printed wiring board, a processor, and a dynamic isolating mount compressed between the printed wiring board and the processor, wherein the processor maintains the dynamic isolating mount in a compressed state such that the dynamic isolating mount bears on the printed wiring board.

Abstract: The present invention relates to a method and apparatus that minimizes shock/vibrational motion in interposer sockets. The ability to control shock/vibration can ensure successful operation and substantially increase socket lifetime. The present invention discloses a device for maintaining a heat sink in a desired relationship to a mounting base while limiting the transmission of shock and vibrational motion to and from the heat sink includes a fastener extending from the mounting base, a spring compressed between the fastener and the heat sink, and a damper compressed between the fastener and the sink wherein the fastener maintains the spring and the damper in a compressed state such that the spring and the damper bear on said heat sink.