Abstract: A method of connecting a heatspreader to an integrated circuit device that is connected to a substrate in a flip-chip configuration includes forming a heatspreader from a single flat sheet of metal. The heatspreader has a heatspreader plate and a plurality of legs. The legs are flat plate portions substantially parallel to the heatspreader plate. A first thermal interface material is used to connect the heatspreader plate to a non-active side of the integrated circuit device. A second thermal interface material is used to connect each of the plurality of legs to the substrate.

Abstract: A circuit board assembly includes an integrated circuit package. A first substrate has first and second surfaces. Each surface of the first substrate has a plurality of terminal pads. An integrated circuit device has first and second faces. The first face has a plurality of electrical interconnections to the terminal pads in the first surface of the first substrate. A heatspreader plate has a plurality of legs. For example, the heatspreader may be shaped like a table with four legs. The heatspreader may be formed of copper. The second face of the integrated circuit device is connected to the heatspreader plate by a first thermal interface material. Each of the plurality of legs is connected to the first surface of the first substrate by a second thermal interface material. The first and second thermal interface materials may both be, for example, a conductive silver-filled epoxy. The heatspreader provides an open package that is easily cleaned and drained.