Patents by Inventor Raymond J. Schmidt, Jr.

Raymond J. Schmidt, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic interconnection method and apparatus for minimizing propagation delays
    Patent number: 6015300
    Abstract: A module interconnection system which minimizes electronic signal propagation delays is disclosed. The module interconnection system includes a backplane, a first plurality of connectors arranged in a side by side generally parallel arrangement, and a second plurality of connectors arranged in a side by side generally parallel arrangement. In a preferred embodiment, the second plurality of connectors are mounted on the backplane at right angles to the first plurality of connectors so as provide short routing paths between each of the second plurality of connectors and at least one of the first plurality of connectors. Point-to-point signal interconnections are selectively utilized to provide data paths between selected contacts of at least one of the first plurality of connectors and selected contacts of the second plurality of connectors.
    Type: Grant
    Filed: August 28, 1997
    Date of Patent: January 18, 2000
    Assignee: Ascend Communications, Inc.
    Inventors: Raymond J. Schmidt, Jr., Mahesh N. Ganmukhi, Patrick L. DeAngelis