Patents by Inventor Raymond Jin

Raymond Jin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chemical mechanical polishing a substrate having a filler layer and a stop layer
    Publication number: 20050153561
    Abstract: A substrate is chemical mechanical polished with a high-selectivity slurry until the stop layer is at least partially exposed, and then the substrate is polished with a low-selectivity slurry until the stop layer is completely exposed.
    Type: Application
    Filed: March 8, 2005
    Publication date: July 14, 2005
    Inventors: Raymond Jin, Shijian Li, Fred Redeker, Thomas Osterheld