Abstract: A redundant resistor matching detector is provided with constant percentage threshold. The redundant resistor matching detector includes a voltage reference and a first operational amplifier, a second operational amplifier, a first potentiometer and a reference potentiometer. The first operational amplifier has a first input connected to a first potentiometer. The second operational amplifier has a first input connected to the reference potentiometer. The first operational amplifier and the second operational amplifier have a reference input coupled to the voltage reference. An input current mirror is coupled to the first potentiometer providing a first current. A first reference current mirror is coupled to the reference potentiometer providing a reference current. A second reference current mirror has an input coupled to a first output of the first reference current mirror and has a first output coupled to an output of the input current mirror.

Abstract: A method and apparatus are provided for laser safety. A fault detector detects laser fault conditions and generates a laser fault control signal. A laser fault counter is coupled to the fault detector for counting laser fault conditions and for generating a disable laser control signal responsive to a predetermined fault count. A reset timer is coupled to the laser fault counter for identifying a predetermined reset time period responsive to the laser fault control signal and applying a reset signal to the laser fault counter. Features of laser safety method and apparatus of the invention are that the laser fault counter is reset if a second laser fault condition is not detected within the predetermined reset time period after the laser is turned on. The disable laser control signal is not generated when a safe laser optical power condition occurs between two laser fault conditions.

Abstract: A package for containing a high speed electronic assembly has a small physical size, shielding, pluggability, and is capable of operating at multigigabit transmission rates. The package includes a module and a cover which covers at least the top of the module. An optical assembly and a circuit packaging are inserted into the module. The package, with an appropriate cover, can be removed and inserted without disturbing other packages secured on the board. The circuit packaging is electrically connected to the board through bump connectors, while the circuit packaging itself supplies a normal force for insuring the bump connectors are in contact with the board. The package is attached to the board using an attachment member which is separate from the bump connectors. The bump connectors facilitate high speed transmission.