Patents by Inventor Raymond Jones
Raymond Jones has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11377588Abstract: A well treatment fluid composition that includes a tetrakis(hydroxyorgano)phosphonium salt and 1,3-dimethylol-5,5-dimethylhydantoin. Methods for preparing a well treatment fluid composition and treating a subterranean formation are also presented.Type: GrantFiled: March 1, 2021Date of Patent: July 5, 2022Assignee: SOLVAY USA INC.Inventors: Christopher Raymond Jones, Stephanie Edmunds, Jean C. Molina
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Publication number: 20220190843Abstract: A seemingly monolithic interface between separate integrated circuit die may appear to be parallel or asynchronous from the perspective of the separate integrated circuit die. The signals of the seemingly monolithic interface, however, may actually be communicated between the separate die via serial and/or synchronous communication. In one method, a number of signals stored in a first parallel interface on a first integrated circuit die may be sampled. In some cases, at least one of the signals may be sampled more often than another one of the signals. A serial signal may be generated based on sampled signals. The serial signal may be transmitted to a corresponding second parallel interface on the second integrated circuit die.Type: ApplicationFiled: July 26, 2021Publication date: June 16, 2022Inventors: David W. Mendel, Jeffrey Erik Schulz, Keith Duwel, Huy Ngo, Jakob Raymond Jones
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Publication number: 20220130278Abstract: The embodiments disclose a method including using an on-demand roleplay network with internet connectivity to role playing study materials and real-time role playing sessions, connecting an on-demand roleplay application installed on role playing participant digital devices with the on-demand roleplay network to facilitate role playing partners real-time practice sessions, incorporating an artificial intelligence communicator coach analyzer with the on-demand roleplay network to provide role playing participants with nonverbal communication analysis and coaching, and providing role playing participants with a means to rate live practice sessions including the nonverbal communication skills.Type: ApplicationFiled: October 22, 2020Publication date: April 28, 2022Inventors: Thomas Ferry, David Shanks, Raymond Jones
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Publication number: 20220121595Abstract: An interface bridge to enable communication between a first integrated circuit die and a second integrated circuit die is disclosed. The two integrated circuit die may be connected via chip-to-chip interconnects. The first integrated circuit die may include programmable logic fabric. The second integrated circuit die may support the first integrated circuit die. The first integrated circuit die and the secondary integrated circuit die may communicate with one another via the chip-to-chip interconnects using an interface bridge. The first and second component integrated circuits may include circuitry to implement the interface bridge, which may provide source-synchronous communication using a data receive clock from the second integrated circuit die to the first integrated circuit die.Type: ApplicationFiled: December 24, 2021Publication date: April 21, 2022Inventors: Jeffrey Erik Schulz, David W. Mendel, Dinesh D. Patil, Gary Brian Wallichs, Keith Duwel, Jakob Raymond Jones
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Patent number: 11237998Abstract: An interface bridge to enable communication between a first integrated circuit die and a second integrated circuit die is disclosed. The two integrated circuit die may be connected via chip-to-chip interconnects. The first integrated circuit die may include programmable logic fabric. The second integrated circuit die may support the first integrated circuit die. The first integrated circuit die and the secondary integrated circuit die may communicate with one another via the chip-to-chip interconnects using an interface bridge. The first and second component integrated circuits may include circuitry to implement the interface bridge, which may provide source-synchronous communication using a data receive clock from the second integrated circuit die to the first integrated circuit die.Type: GrantFiled: December 22, 2020Date of Patent: February 1, 2022Assignee: Intel CorporationInventors: Jeffrey Erik Schulz, David W. Mendel, Dinesh D. Patil, Gary Brian Wallichs, Keith Duwel, Jakob Raymond Jones
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Patent number: 11191276Abstract: The present invention relates to a solid formulation of soap stick type comprising a primary surfactant, at least one binding agent and at least one dispersant that may especially be an amphoteric surfactant, optionally with additives. The present invention also relates to uses of said formulation, especially for oilfield applications, e.g. for gas well deliquification applications.Type: GrantFiled: May 20, 2019Date of Patent: December 7, 2021Assignee: RHODIA OPERATIONSInventors: Christopher Raymond Jones, Kevan Hatchman, Alan Christopher Fellows
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Patent number: 11100029Abstract: An interface bridge to enable communication between a first integrated circuit die and a second integrated circuit die is disclosed. The two integrated circuit die may be connected via chip-to-chip interconnects. The first integrated circuit die may include programmable logic fabric. The second integrated circuit die may support the first integrated circuit die. The first integrated circuit die and the secondary integrated circuit die may communicate with one another via the chip-to-chip interconnects using an interface bridge. The first and second component integrated circuits may include circuitry to implement the interface bridge, which may provide source-synchronous communication using a data receive clock from the second integrated circuit die to the first integrated circuit die.Type: GrantFiled: August 8, 2019Date of Patent: August 24, 2021Assignee: Intel CorporationInventors: Jeffrey Erik Schulz, David W. Mendel, Dinesh D. Patil, Gary Brian Wallichs, Keith Duwel, Jakob Raymond Jones
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Patent number: 11075648Abstract: A seemingly monolithic interface between separate integrated circuit die may appear to be parallel or asynchronous from the perspective of the separate integrated circuit die. The signals of the seemingly monolithic interface, however, may actually be communicated between the separate die via serial and/or synchronous communication. In one method, a number of signals stored in a first parallel interface on a first integrated circuit die may be sampled. In some cases, at least one of the signals may be sampled more often than another one of the signals. A serial signal may be generated based on sampled signals. The serial signal may be transmitted to a corresponding second parallel interface on the second integrated circuit die.Type: GrantFiled: September 27, 2019Date of Patent: July 27, 2021Assignee: Intel CorporationInventors: David W. Mendel, Jeffrey Erik Schulz, Keith Duwel, Huy Ngo, Jakob Raymond Jones
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Publication number: 20210179927Abstract: A well treatment fluid composition that includes a tetrakis(hydroxyorgano)phosphonium salt and 1,3-dimethylol-5,5-dimethylhydantoin. Methods for preparing a well treatment fluid composition and treating a subterranean formation are also presented.Type: ApplicationFiled: March 1, 2021Publication date: June 17, 2021Applicant: SOLVAY USA INC.Inventors: Christopher Raymond Jones, Stephanie Edmunds, Jean C. Molina
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Publication number: 20210109883Abstract: An interface bridge to enable communication between a first integrated circuit die and a second integrated circuit die is disclosed. The two integrated circuit die may be connected via chip-to-chip interconnects. The first integrated circuit die may include programmable logic fabric. The second integrated circuit die may support the first integrated circuit die. The first integrated circuit die and the secondary integrated circuit die may communicate with one another via the chip-to-chip interconnects using an interface bridge. The first and second component integrated circuits may include circuitry to implement the interface bridge, which may provide source-synchronous communication using a data receive clock from the second integrated circuit die to the first integrated circuit die.Type: ApplicationFiled: December 22, 2020Publication date: April 15, 2021Inventors: Jeffrey Erik Schulz, David W. Mendel, Dinesh D. Patil, Gary Brian Wallichs, Keith Duwel, Jacob Raymond Jones
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Patent number: 10968384Abstract: A well treatment fluid composition that includes a tetrakis(hydroxyorgano)phosphonium salt and 1,3-dimethylol-5,5-dimethylhydantoin. Methods for preparing a well treatment fluid composition and treating a subterranean formation are also presented.Type: GrantFiled: December 6, 2016Date of Patent: April 6, 2021Assignee: SOLVAY USA INC.Inventors: Christopher Raymond Jones, Stéphanie Edmunds, Jean C. Molina
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Patent number: 10831960Abstract: Systems and methods for reconfiguration of a hardened intellectual property (IP) block in an integrated circuit (IC) device are provided. Reconfiguration of the hardened IP block in the IC device may transition between functions supported by the hardened IP block. A transition may occur as a pre-configured profile is selected to reconfigure the hardened IP block. Further, configuration data associated with each of the pre-configured profiles of the hardened IP block may be generated and storage space to store the configuration data may be created. Additionally, reconfiguration control logic to read and implement the configuration data in hard IP design primitives may also be generated.Type: GrantFiled: November 13, 2018Date of Patent: November 10, 2020Assignee: Altera CorporationInventors: Jakob Raymond Jones, Prasanna Padmanabhan
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Patent number: 10787542Abstract: The invention relates to inorganic-organic hybrid materials comprising interpenetrated organic and inorganic components, wherein the organic component comprises polymer chains formed at least in part by ring-opening polymerization of a cyclic monomer, and processes for the production thereof.Type: GrantFiled: March 31, 2017Date of Patent: September 29, 2020Assignees: IMPERIAL COLLEGE INNOVATIONS LIMITED, UNIVERSITÀ DEGLI STUDI DI MILANO—BICOCCAInventors: Francesca Tallia, Julian Raymond Jones, Laura Francesca Cipolla, Laura Russo, Gloria Ruth Young
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Patent number: 10550482Abstract: The invention provides the use of a surfactant as a corrosion inhibitor, wherein the surfactant is selected from derivatives of alkyl polyglucosides and derivatives of terpene alkoxylates, and mixtures thereof, provided that the derivatives are not sulfosuccinates. Also provided is a method of preventing or reducing corrosion of a metal component that is in contact with, or will be in contact with, an aqueous fluid, wherein the method comprises providing a surfactant and applying the surfactant to the metal component or adding the surfactant to the aqueous fluid that is in contact with, or will be in contact with, the metal component, wherein the surfactant is selected from derivatives of alkyl polyglucosides and derivatives of terpene alkoxylates, and mixtures thereof, provided that the derivatives are not sulfosuccinates.Type: GrantFiled: January 30, 2013Date of Patent: February 4, 2020Assignee: RHODIA OPERATIONSInventors: Kevan Hatchman, Alan Fellows, Christopher Raymond Jones, Gareth Collins
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Publication number: 20200028521Abstract: A seemingly monolithic interface between separate integrated circuit die may appear to be parallel or asynchronous from the perspective of the separate integrated circuit die. The signals of the seemingly monolithic interface, however, may actually be communicated between the separate die via serial and/or synchronous communication. In one method, a number of signals stored in a first parallel interface on a first integrated circuit die may be sampled. In some cases, at least one of the signals may be sampled more often than another one of the signals. A serial signal may be generated based on sampled signals. The serial signal may be transmitted to a corresponding second parallel interface on the second integrated circuit die.Type: ApplicationFiled: September 27, 2019Publication date: January 23, 2020Inventors: David W. Mendel, Jeffrey Erik Schulz, Keith Duwel, Huy Ngo, Jakob Raymond Jones
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Publication number: 20190361831Abstract: An interface bridge to enable communication between a first integrated circuit die and a second integrated circuit die is disclosed. The two integrated circuit die may be connected via chip-to-chip interconnects. The first integrated circuit die may include programmable logic fabric. The second integrated circuit die may support the first integrated circuit die. The first integrated circuit die and the secondary integrated circuit die may communicate with one another via the chip-to-chip interconnects using an interface bridge. The first and second component integrated circuits may include circuitry to implement the interface bridge, which may provide source-synchronous communication using a data receive clock from the second integrated circuit die to the first integrated circuit die.Type: ApplicationFiled: August 8, 2019Publication date: November 28, 2019Inventors: Jeffrey Erik Schulz, David W. Mendel, Dinesh D. Patil, Gary Brian Wallichs, Keith Duwel, Jakob Raymond Jones
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Publication number: 20190316027Abstract: The present invention relates to a solid formulation of soap stick type comprising a primary surfactant, at least one binding agent and at least one dispersant that may especially be an amphoteric surfactant, optionally with additives. The present invention also relates to uses of said formulation, especially for oilfield applications, e.g. for gas well deliquification applications.Type: ApplicationFiled: May 20, 2019Publication date: October 17, 2019Inventors: Christopher Raymond JONES, Kevan HATCHMAN, Alan Christopher FELLOWS
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Patent number: 10445278Abstract: An interface bridge to enable communication between a first integrated circuit die and a second integrated circuit die is disclosed. The two integrated circuit die may be connected via chip-to-chip interconnects. The first integrated circuit die may include programmable logic fabric. The second integrated circuit die may support the first integrated circuit die. The first integrated circuit die and the secondary integrated circuit die may communicate with one another via the chip-to-chip interconnects using an interface bridge. The first and second component integrated circuits may include circuitry to implement the interface bridge, which may provide source-synchronous communication using a data receive clock from the second integrated circuit die to the first integrated circuit die.Type: GrantFiled: December 28, 2016Date of Patent: October 15, 2019Assignee: Intel CorporationInventors: Jeffrey Erik Schulz, David W. Mendel, Dinesh D. Patil, Gary Brian Wallichs, Keith Duwel, Jakob Raymond Jones
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Patent number: 10439639Abstract: A seemingly monolithic interface between separate integrated circuit die may appear to be parallel or asynchronous from the perspective of the separate integrated circuit die. The signals of the seemingly monolithic interface, however, may actually be communicated between the separate die via serial and/or synchronous communication. In one method, a number of signals stored in a first parallel interface on a first integrated circuit die may be sampled. In some cases, at least one of the signals may be sampled more often than another one of the signals. A serial signal may be generated based on sampled signals. The serial signal may be transmitted to a corresponding second parallel interface on the second integrated circuit die.Type: GrantFiled: December 28, 2016Date of Patent: October 8, 2019Assignee: INTEL CORPORATIONInventors: David W. Mendel, Jeffrey Erik Schulz, Keith Duwel, Huy Ngo, Jakob Raymond Jones
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Publication number: 20190112422Abstract: The invention relates to inorganic-organic hybrid materials comprising interpenetrated organic and inorganic components, wherein the organic component comprises polymer chains formed at least in part by ring-opening polymerization of a cyclic monomer, and processes for the production thereof.Type: ApplicationFiled: March 31, 2017Publication date: April 18, 2019Inventors: Francesca Tallia, Julian Raymond Jones, Laura Francesca Cipolla, Laura Russo, Gloria Ruth Young