Patents by Inventor Raymond Jones

Raymond Jones has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250021506
    Abstract: An interface bridge to enable communication between a first integrated circuit die and a second integrated circuit die is disclosed. The two integrated circuit die may be connected via chip-to-chip interconnects. The first integrated circuit die may include programmable logic fabric. The second integrated circuit die may support the first integrated circuit die. The first integrated circuit die and the secondary integrated circuit die may communicate with one another via the chip-to-chip interconnects using an interface bridge. The first and second component integrated circuits may include circuitry to implement the interface bridge, which may provide source-synchronous communication using a data receive clock from the second integrated circuit die to the first integrated circuit die.
    Type: Application
    Filed: September 27, 2024
    Publication date: January 16, 2025
    Inventors: Jeffrey Erik Schulz, David W. Mendel, Dinesh D. Patil, Gary Brian Wallichs, Keith Duwel, Jakob Raymond Jones
  • Patent number: 12191893
    Abstract: A seemingly monolithic interface between separate integrated circuit die may appear to be parallel or asynchronous from the perspective of the separate integrated circuit die. The signals of the seemingly monolithic interface, however, may actually be communicated between the separate die via serial and/or synchronous communication. In one method, a number of signals stored in a first parallel interface on a first integrated circuit die may be sampled. In some cases, at least one of the signals may be sampled more often than another one of the signals. A serial signal may be generated based on sampled signals. The serial signal may be transmitted to a corresponding second parallel interface on the second integrated circuit die.
    Type: Grant
    Filed: July 26, 2021
    Date of Patent: January 7, 2025
    Assignee: ALTERA CORPORATION
    Inventors: David W. Mendel, Jeffrey Erik Schulz, Keith Duwel, Huy Ngo, Jakob Raymond Jones
  • Patent number: 12168624
    Abstract: The present disclosure provides an improved scale inhibiting formulation that is effective, environmentally friendly, and does not add any organic compounds or traditional polymeric compounds to treated water. The scale inhibiting composition includes molecular clusters of polyammonium bisulfate (PABS), which can interact physically, chemically, or physio-chemically with one or more ions in the water or water-containing system being treated. That interaction inhibits scale accretion and/or removes previously formed scale.
    Type: Grant
    Filed: March 1, 2021
    Date of Patent: December 17, 2024
    Assignee: Earth Science Laboratories, Inc.
    Inventors: David Nicholas, Reid Henry Bowman, John A. Hatten, Jr., Freddie L. Singleton, Douglas Brian McKenzie, Murray Raymond Jones
  • Patent number: 12135667
    Abstract: An interface bridge to enable communication between a first integrated circuit die and a second integrated circuit die is disclosed. The two integrated circuit die may be connected via chip-to-chip interconnects. The first integrated circuit die may include programmable logic fabric. The second integrated circuit die may support the first integrated circuit die. The first integrated circuit die and the secondary integrated circuit die may communicate with one another via the chip-to-chip interconnects using an interface bridge. The first and second component integrated circuits may include circuitry to implement the interface bridge, which may provide source-synchronous communication using a data receive clock from the second integrated circuit die to the first integrated circuit die.
    Type: Grant
    Filed: May 31, 2023
    Date of Patent: November 5, 2024
    Assignee: ALTERA CORPORATION
    Inventors: Jeffrey Erik Schulz, David W. Mendel, Dinesh D. Patil, Gary Brian Wallichs, Keith Duwel, Jakob Raymond Jones
  • Patent number: 12038837
    Abstract: A data processing device incorporates a plurality of chiplets having working elements such as processing and memory elements. At least one of the working elements is operative to generate messages directed to working elements of the same chiplet or another one of the chiplets. Each message includes a global address. An evaluation circuit determines whether the global address of a message is within a range of global addresses assigned to the chiplet. If so, the message passes to a translation circuit which translates the message to a local address for routing to a working element of the chiplet. If not, the message is dispatched to one or more other chiplets.
    Type: Grant
    Filed: December 15, 2022
    Date of Patent: July 16, 2024
    Assignee: Google LLC
    Inventors: Xi Chen, Chao Ni, Jakob Raymond Jones
  • Publication number: 20240202115
    Abstract: A data processing device incorporates a plurality of chiplets having working elements such as processing and memory elements. At least one of the working elements is operative to generate messages directed to working elements of the same chiplet or another one of the chiplets. Each message includes a global address. An evaluation circuit determines whether the global address of a message is within a range of global addresses assigned to the chiplet. If so, the message passes to a translation circuit which translates the message to a local address for routing to a working element of the chiplet. If not, the message is dispatched to one or more other chiplets.
    Type: Application
    Filed: December 15, 2022
    Publication date: June 20, 2024
    Inventors: Xi Chen, Chao Ni, Jakob Raymond Jones
  • Publication number: 20230305982
    Abstract: An interface bridge to enable communication between a first integrated circuit die and a second integrated circuit die is disclosed. The two integrated circuit die may be connected via chip-to-chip interconnects. The first integrated circuit die may include programmable logic fabric. The second integrated circuit die may support the first integrated circuit die. The first integrated circuit die and the secondary integrated circuit die may communicate with one another via the chip-to-chip interconnects using an interface bridge. The first and second component integrated circuits may include circuitry to implement the interface bridge, which may provide source-synchronous communication using a data receive clock from the second integrated circuit die to the first integrated circuit die.
    Type: Application
    Filed: May 31, 2023
    Publication date: September 28, 2023
    Inventors: Jeffrey Erik Schulz, David W. Mendel, Dinesh D. Patil, Gary Brian Wallichs, Keith Duwel, Jakob Raymond Jones
  • Patent number: 11693810
    Abstract: An interface bridge to enable communication between a first integrated circuit die and a second integrated circuit die is disclosed. The two integrated circuit die may be connected via chip-to-chip interconnects. The first integrated circuit die may include programmable logic fabric. The second integrated circuit die may support the first integrated circuit die. The first integrated circuit die and the secondary integrated circuit die may communicate with one another via the chip-to-chip interconnects using an interface bridge. The first and second component integrated circuits may include circuitry to implement the interface bridge, which may provide source-synchronous communication using a data receive clock from the second integrated circuit die to the first integrated circuit die.
    Type: Grant
    Filed: December 24, 2021
    Date of Patent: July 4, 2023
    Assignee: Intel Corporation
    Inventors: Jeffrey Erik Schulz, David W. Mendel, Dinesh D. Patil, Gary Brian Wallichs, Keith Duwel, Jakob Raymond Jones
  • Publication number: 20230174402
    Abstract: The present disclosure provides an improved scale inhibiting formulation that is effective, environmentally friendly, and does not add any organic compounds or traditional polymeric compounds to treated water. The scale inhibiting composition includes molecular clusters of polyammonium bisulfate (PABS), which can interact physically, chemically, or physio-chemically with one or more ions in the water or water-containing system being treated. That interaction inhibits scale accretion and/or removes previously formed scale.
    Type: Application
    Filed: March 1, 2021
    Publication date: June 8, 2023
    Applicant: Earth Science Laboratories, Inc.
    Inventors: DAVID NICHOLAS, REID HENRY BOWMAN, JOHN A. HATTEN, JR., FREDDIE L. SINGLETON, DOUGLAS BRIAN MCKENZIE, Murray Raymond Jones
  • Patent number: 11663928
    Abstract: The embodiments disclose a method including using an on-demand roleplay network with internet connectivity to role playing study materials and real-time role playing sessions, connecting an on-demand roleplay application installed on role playing participant digital devices with the on-demand roleplay network to facilitate role playing partners real-time practice sessions, incorporating an artificial intelligence communicator coach analyzer with the on-demand roleplay network to provide role playing participants with nonverbal communication analysis and coaching, and providing role playing participants with a means to rate live practice sessions including the nonverbal communication skills.
    Type: Grant
    Filed: October 22, 2020
    Date of Patent: May 30, 2023
    Inventors: Thomas Ferry, David Shanks, Raymond Jones
  • Patent number: 11377588
    Abstract: A well treatment fluid composition that includes a tetrakis(hydroxyorgano)phosphonium salt and 1,3-dimethylol-5,5-dimethylhydantoin. Methods for preparing a well treatment fluid composition and treating a subterranean formation are also presented.
    Type: Grant
    Filed: March 1, 2021
    Date of Patent: July 5, 2022
    Assignee: SOLVAY USA INC.
    Inventors: Christopher Raymond Jones, Stephanie Edmunds, Jean C. Molina
  • Publication number: 20220190843
    Abstract: A seemingly monolithic interface between separate integrated circuit die may appear to be parallel or asynchronous from the perspective of the separate integrated circuit die. The signals of the seemingly monolithic interface, however, may actually be communicated between the separate die via serial and/or synchronous communication. In one method, a number of signals stored in a first parallel interface on a first integrated circuit die may be sampled. In some cases, at least one of the signals may be sampled more often than another one of the signals. A serial signal may be generated based on sampled signals. The serial signal may be transmitted to a corresponding second parallel interface on the second integrated circuit die.
    Type: Application
    Filed: July 26, 2021
    Publication date: June 16, 2022
    Inventors: David W. Mendel, Jeffrey Erik Schulz, Keith Duwel, Huy Ngo, Jakob Raymond Jones
  • Publication number: 20220130278
    Abstract: The embodiments disclose a method including using an on-demand roleplay network with internet connectivity to role playing study materials and real-time role playing sessions, connecting an on-demand roleplay application installed on role playing participant digital devices with the on-demand roleplay network to facilitate role playing partners real-time practice sessions, incorporating an artificial intelligence communicator coach analyzer with the on-demand roleplay network to provide role playing participants with nonverbal communication analysis and coaching, and providing role playing participants with a means to rate live practice sessions including the nonverbal communication skills.
    Type: Application
    Filed: October 22, 2020
    Publication date: April 28, 2022
    Inventors: Thomas Ferry, David Shanks, Raymond Jones
  • Publication number: 20220121595
    Abstract: An interface bridge to enable communication between a first integrated circuit die and a second integrated circuit die is disclosed. The two integrated circuit die may be connected via chip-to-chip interconnects. The first integrated circuit die may include programmable logic fabric. The second integrated circuit die may support the first integrated circuit die. The first integrated circuit die and the secondary integrated circuit die may communicate with one another via the chip-to-chip interconnects using an interface bridge. The first and second component integrated circuits may include circuitry to implement the interface bridge, which may provide source-synchronous communication using a data receive clock from the second integrated circuit die to the first integrated circuit die.
    Type: Application
    Filed: December 24, 2021
    Publication date: April 21, 2022
    Inventors: Jeffrey Erik Schulz, David W. Mendel, Dinesh D. Patil, Gary Brian Wallichs, Keith Duwel, Jakob Raymond Jones
  • Patent number: 11237998
    Abstract: An interface bridge to enable communication between a first integrated circuit die and a second integrated circuit die is disclosed. The two integrated circuit die may be connected via chip-to-chip interconnects. The first integrated circuit die may include programmable logic fabric. The second integrated circuit die may support the first integrated circuit die. The first integrated circuit die and the secondary integrated circuit die may communicate with one another via the chip-to-chip interconnects using an interface bridge. The first and second component integrated circuits may include circuitry to implement the interface bridge, which may provide source-synchronous communication using a data receive clock from the second integrated circuit die to the first integrated circuit die.
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: February 1, 2022
    Assignee: Intel Corporation
    Inventors: Jeffrey Erik Schulz, David W. Mendel, Dinesh D. Patil, Gary Brian Wallichs, Keith Duwel, Jakob Raymond Jones
  • Patent number: 11191276
    Abstract: The present invention relates to a solid formulation of soap stick type comprising a primary surfactant, at least one binding agent and at least one dispersant that may especially be an amphoteric surfactant, optionally with additives. The present invention also relates to uses of said formulation, especially for oilfield applications, e.g. for gas well deliquification applications.
    Type: Grant
    Filed: May 20, 2019
    Date of Patent: December 7, 2021
    Assignee: RHODIA OPERATIONS
    Inventors: Christopher Raymond Jones, Kevan Hatchman, Alan Christopher Fellows
  • Patent number: 11100029
    Abstract: An interface bridge to enable communication between a first integrated circuit die and a second integrated circuit die is disclosed. The two integrated circuit die may be connected via chip-to-chip interconnects. The first integrated circuit die may include programmable logic fabric. The second integrated circuit die may support the first integrated circuit die. The first integrated circuit die and the secondary integrated circuit die may communicate with one another via the chip-to-chip interconnects using an interface bridge. The first and second component integrated circuits may include circuitry to implement the interface bridge, which may provide source-synchronous communication using a data receive clock from the second integrated circuit die to the first integrated circuit die.
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: August 24, 2021
    Assignee: Intel Corporation
    Inventors: Jeffrey Erik Schulz, David W. Mendel, Dinesh D. Patil, Gary Brian Wallichs, Keith Duwel, Jakob Raymond Jones
  • Patent number: 11075648
    Abstract: A seemingly monolithic interface between separate integrated circuit die may appear to be parallel or asynchronous from the perspective of the separate integrated circuit die. The signals of the seemingly monolithic interface, however, may actually be communicated between the separate die via serial and/or synchronous communication. In one method, a number of signals stored in a first parallel interface on a first integrated circuit die may be sampled. In some cases, at least one of the signals may be sampled more often than another one of the signals. A serial signal may be generated based on sampled signals. The serial signal may be transmitted to a corresponding second parallel interface on the second integrated circuit die.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: July 27, 2021
    Assignee: Intel Corporation
    Inventors: David W. Mendel, Jeffrey Erik Schulz, Keith Duwel, Huy Ngo, Jakob Raymond Jones
  • Publication number: 20210179927
    Abstract: A well treatment fluid composition that includes a tetrakis(hydroxyorgano)phosphonium salt and 1,3-dimethylol-5,5-dimethylhydantoin. Methods for preparing a well treatment fluid composition and treating a subterranean formation are also presented.
    Type: Application
    Filed: March 1, 2021
    Publication date: June 17, 2021
    Applicant: SOLVAY USA INC.
    Inventors: Christopher Raymond Jones, Stephanie Edmunds, Jean C. Molina
  • Publication number: 20210109883
    Abstract: An interface bridge to enable communication between a first integrated circuit die and a second integrated circuit die is disclosed. The two integrated circuit die may be connected via chip-to-chip interconnects. The first integrated circuit die may include programmable logic fabric. The second integrated circuit die may support the first integrated circuit die. The first integrated circuit die and the secondary integrated circuit die may communicate with one another via the chip-to-chip interconnects using an interface bridge. The first and second component integrated circuits may include circuitry to implement the interface bridge, which may provide source-synchronous communication using a data receive clock from the second integrated circuit die to the first integrated circuit die.
    Type: Application
    Filed: December 22, 2020
    Publication date: April 15, 2021
    Inventors: Jeffrey Erik Schulz, David W. Mendel, Dinesh D. Patil, Gary Brian Wallichs, Keith Duwel, Jacob Raymond Jones