Patents by Inventor Raymond Jones

Raymond Jones has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11377588
    Abstract: A well treatment fluid composition that includes a tetrakis(hydroxyorgano)phosphonium salt and 1,3-dimethylol-5,5-dimethylhydantoin. Methods for preparing a well treatment fluid composition and treating a subterranean formation are also presented.
    Type: Grant
    Filed: March 1, 2021
    Date of Patent: July 5, 2022
    Assignee: SOLVAY USA INC.
    Inventors: Christopher Raymond Jones, Stephanie Edmunds, Jean C. Molina
  • Publication number: 20220190843
    Abstract: A seemingly monolithic interface between separate integrated circuit die may appear to be parallel or asynchronous from the perspective of the separate integrated circuit die. The signals of the seemingly monolithic interface, however, may actually be communicated between the separate die via serial and/or synchronous communication. In one method, a number of signals stored in a first parallel interface on a first integrated circuit die may be sampled. In some cases, at least one of the signals may be sampled more often than another one of the signals. A serial signal may be generated based on sampled signals. The serial signal may be transmitted to a corresponding second parallel interface on the second integrated circuit die.
    Type: Application
    Filed: July 26, 2021
    Publication date: June 16, 2022
    Inventors: David W. Mendel, Jeffrey Erik Schulz, Keith Duwel, Huy Ngo, Jakob Raymond Jones
  • Publication number: 20220130278
    Abstract: The embodiments disclose a method including using an on-demand roleplay network with internet connectivity to role playing study materials and real-time role playing sessions, connecting an on-demand roleplay application installed on role playing participant digital devices with the on-demand roleplay network to facilitate role playing partners real-time practice sessions, incorporating an artificial intelligence communicator coach analyzer with the on-demand roleplay network to provide role playing participants with nonverbal communication analysis and coaching, and providing role playing participants with a means to rate live practice sessions including the nonverbal communication skills.
    Type: Application
    Filed: October 22, 2020
    Publication date: April 28, 2022
    Inventors: Thomas Ferry, David Shanks, Raymond Jones
  • Publication number: 20220121595
    Abstract: An interface bridge to enable communication between a first integrated circuit die and a second integrated circuit die is disclosed. The two integrated circuit die may be connected via chip-to-chip interconnects. The first integrated circuit die may include programmable logic fabric. The second integrated circuit die may support the first integrated circuit die. The first integrated circuit die and the secondary integrated circuit die may communicate with one another via the chip-to-chip interconnects using an interface bridge. The first and second component integrated circuits may include circuitry to implement the interface bridge, which may provide source-synchronous communication using a data receive clock from the second integrated circuit die to the first integrated circuit die.
    Type: Application
    Filed: December 24, 2021
    Publication date: April 21, 2022
    Inventors: Jeffrey Erik Schulz, David W. Mendel, Dinesh D. Patil, Gary Brian Wallichs, Keith Duwel, Jakob Raymond Jones
  • Patent number: 11237998
    Abstract: An interface bridge to enable communication between a first integrated circuit die and a second integrated circuit die is disclosed. The two integrated circuit die may be connected via chip-to-chip interconnects. The first integrated circuit die may include programmable logic fabric. The second integrated circuit die may support the first integrated circuit die. The first integrated circuit die and the secondary integrated circuit die may communicate with one another via the chip-to-chip interconnects using an interface bridge. The first and second component integrated circuits may include circuitry to implement the interface bridge, which may provide source-synchronous communication using a data receive clock from the second integrated circuit die to the first integrated circuit die.
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: February 1, 2022
    Assignee: Intel Corporation
    Inventors: Jeffrey Erik Schulz, David W. Mendel, Dinesh D. Patil, Gary Brian Wallichs, Keith Duwel, Jakob Raymond Jones
  • Patent number: 11191276
    Abstract: The present invention relates to a solid formulation of soap stick type comprising a primary surfactant, at least one binding agent and at least one dispersant that may especially be an amphoteric surfactant, optionally with additives. The present invention also relates to uses of said formulation, especially for oilfield applications, e.g. for gas well deliquification applications.
    Type: Grant
    Filed: May 20, 2019
    Date of Patent: December 7, 2021
    Assignee: RHODIA OPERATIONS
    Inventors: Christopher Raymond Jones, Kevan Hatchman, Alan Christopher Fellows
  • Patent number: 11100029
    Abstract: An interface bridge to enable communication between a first integrated circuit die and a second integrated circuit die is disclosed. The two integrated circuit die may be connected via chip-to-chip interconnects. The first integrated circuit die may include programmable logic fabric. The second integrated circuit die may support the first integrated circuit die. The first integrated circuit die and the secondary integrated circuit die may communicate with one another via the chip-to-chip interconnects using an interface bridge. The first and second component integrated circuits may include circuitry to implement the interface bridge, which may provide source-synchronous communication using a data receive clock from the second integrated circuit die to the first integrated circuit die.
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: August 24, 2021
    Assignee: Intel Corporation
    Inventors: Jeffrey Erik Schulz, David W. Mendel, Dinesh D. Patil, Gary Brian Wallichs, Keith Duwel, Jakob Raymond Jones
  • Patent number: 11075648
    Abstract: A seemingly monolithic interface between separate integrated circuit die may appear to be parallel or asynchronous from the perspective of the separate integrated circuit die. The signals of the seemingly monolithic interface, however, may actually be communicated between the separate die via serial and/or synchronous communication. In one method, a number of signals stored in a first parallel interface on a first integrated circuit die may be sampled. In some cases, at least one of the signals may be sampled more often than another one of the signals. A serial signal may be generated based on sampled signals. The serial signal may be transmitted to a corresponding second parallel interface on the second integrated circuit die.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: July 27, 2021
    Assignee: Intel Corporation
    Inventors: David W. Mendel, Jeffrey Erik Schulz, Keith Duwel, Huy Ngo, Jakob Raymond Jones
  • Publication number: 20210179927
    Abstract: A well treatment fluid composition that includes a tetrakis(hydroxyorgano)phosphonium salt and 1,3-dimethylol-5,5-dimethylhydantoin. Methods for preparing a well treatment fluid composition and treating a subterranean formation are also presented.
    Type: Application
    Filed: March 1, 2021
    Publication date: June 17, 2021
    Applicant: SOLVAY USA INC.
    Inventors: Christopher Raymond Jones, Stephanie Edmunds, Jean C. Molina
  • Publication number: 20210109883
    Abstract: An interface bridge to enable communication between a first integrated circuit die and a second integrated circuit die is disclosed. The two integrated circuit die may be connected via chip-to-chip interconnects. The first integrated circuit die may include programmable logic fabric. The second integrated circuit die may support the first integrated circuit die. The first integrated circuit die and the secondary integrated circuit die may communicate with one another via the chip-to-chip interconnects using an interface bridge. The first and second component integrated circuits may include circuitry to implement the interface bridge, which may provide source-synchronous communication using a data receive clock from the second integrated circuit die to the first integrated circuit die.
    Type: Application
    Filed: December 22, 2020
    Publication date: April 15, 2021
    Inventors: Jeffrey Erik Schulz, David W. Mendel, Dinesh D. Patil, Gary Brian Wallichs, Keith Duwel, Jacob Raymond Jones
  • Patent number: 10968384
    Abstract: A well treatment fluid composition that includes a tetrakis(hydroxyorgano)phosphonium salt and 1,3-dimethylol-5,5-dimethylhydantoin. Methods for preparing a well treatment fluid composition and treating a subterranean formation are also presented.
    Type: Grant
    Filed: December 6, 2016
    Date of Patent: April 6, 2021
    Assignee: SOLVAY USA INC.
    Inventors: Christopher Raymond Jones, Stéphanie Edmunds, Jean C. Molina
  • Patent number: 10831960
    Abstract: Systems and methods for reconfiguration of a hardened intellectual property (IP) block in an integrated circuit (IC) device are provided. Reconfiguration of the hardened IP block in the IC device may transition between functions supported by the hardened IP block. A transition may occur as a pre-configured profile is selected to reconfigure the hardened IP block. Further, configuration data associated with each of the pre-configured profiles of the hardened IP block may be generated and storage space to store the configuration data may be created. Additionally, reconfiguration control logic to read and implement the configuration data in hard IP design primitives may also be generated.
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: November 10, 2020
    Assignee: Altera Corporation
    Inventors: Jakob Raymond Jones, Prasanna Padmanabhan
  • Patent number: 10787542
    Abstract: The invention relates to inorganic-organic hybrid materials comprising interpenetrated organic and inorganic components, wherein the organic component comprises polymer chains formed at least in part by ring-opening polymerization of a cyclic monomer, and processes for the production thereof.
    Type: Grant
    Filed: March 31, 2017
    Date of Patent: September 29, 2020
    Assignees: IMPERIAL COLLEGE INNOVATIONS LIMITED, UNIVERSITÀ DEGLI STUDI DI MILANO—BICOCCA
    Inventors: Francesca Tallia, Julian Raymond Jones, Laura Francesca Cipolla, Laura Russo, Gloria Ruth Young
  • Patent number: 10550482
    Abstract: The invention provides the use of a surfactant as a corrosion inhibitor, wherein the surfactant is selected from derivatives of alkyl polyglucosides and derivatives of terpene alkoxylates, and mixtures thereof, provided that the derivatives are not sulfosuccinates. Also provided is a method of preventing or reducing corrosion of a metal component that is in contact with, or will be in contact with, an aqueous fluid, wherein the method comprises providing a surfactant and applying the surfactant to the metal component or adding the surfactant to the aqueous fluid that is in contact with, or will be in contact with, the metal component, wherein the surfactant is selected from derivatives of alkyl polyglucosides and derivatives of terpene alkoxylates, and mixtures thereof, provided that the derivatives are not sulfosuccinates.
    Type: Grant
    Filed: January 30, 2013
    Date of Patent: February 4, 2020
    Assignee: RHODIA OPERATIONS
    Inventors: Kevan Hatchman, Alan Fellows, Christopher Raymond Jones, Gareth Collins
  • Publication number: 20200028521
    Abstract: A seemingly monolithic interface between separate integrated circuit die may appear to be parallel or asynchronous from the perspective of the separate integrated circuit die. The signals of the seemingly monolithic interface, however, may actually be communicated between the separate die via serial and/or synchronous communication. In one method, a number of signals stored in a first parallel interface on a first integrated circuit die may be sampled. In some cases, at least one of the signals may be sampled more often than another one of the signals. A serial signal may be generated based on sampled signals. The serial signal may be transmitted to a corresponding second parallel interface on the second integrated circuit die.
    Type: Application
    Filed: September 27, 2019
    Publication date: January 23, 2020
    Inventors: David W. Mendel, Jeffrey Erik Schulz, Keith Duwel, Huy Ngo, Jakob Raymond Jones
  • Publication number: 20190361831
    Abstract: An interface bridge to enable communication between a first integrated circuit die and a second integrated circuit die is disclosed. The two integrated circuit die may be connected via chip-to-chip interconnects. The first integrated circuit die may include programmable logic fabric. The second integrated circuit die may support the first integrated circuit die. The first integrated circuit die and the secondary integrated circuit die may communicate with one another via the chip-to-chip interconnects using an interface bridge. The first and second component integrated circuits may include circuitry to implement the interface bridge, which may provide source-synchronous communication using a data receive clock from the second integrated circuit die to the first integrated circuit die.
    Type: Application
    Filed: August 8, 2019
    Publication date: November 28, 2019
    Inventors: Jeffrey Erik Schulz, David W. Mendel, Dinesh D. Patil, Gary Brian Wallichs, Keith Duwel, Jakob Raymond Jones
  • Publication number: 20190316027
    Abstract: The present invention relates to a solid formulation of soap stick type comprising a primary surfactant, at least one binding agent and at least one dispersant that may especially be an amphoteric surfactant, optionally with additives. The present invention also relates to uses of said formulation, especially for oilfield applications, e.g. for gas well deliquification applications.
    Type: Application
    Filed: May 20, 2019
    Publication date: October 17, 2019
    Inventors: Christopher Raymond JONES, Kevan HATCHMAN, Alan Christopher FELLOWS
  • Patent number: 10445278
    Abstract: An interface bridge to enable communication between a first integrated circuit die and a second integrated circuit die is disclosed. The two integrated circuit die may be connected via chip-to-chip interconnects. The first integrated circuit die may include programmable logic fabric. The second integrated circuit die may support the first integrated circuit die. The first integrated circuit die and the secondary integrated circuit die may communicate with one another via the chip-to-chip interconnects using an interface bridge. The first and second component integrated circuits may include circuitry to implement the interface bridge, which may provide source-synchronous communication using a data receive clock from the second integrated circuit die to the first integrated circuit die.
    Type: Grant
    Filed: December 28, 2016
    Date of Patent: October 15, 2019
    Assignee: Intel Corporation
    Inventors: Jeffrey Erik Schulz, David W. Mendel, Dinesh D. Patil, Gary Brian Wallichs, Keith Duwel, Jakob Raymond Jones
  • Patent number: 10439639
    Abstract: A seemingly monolithic interface between separate integrated circuit die may appear to be parallel or asynchronous from the perspective of the separate integrated circuit die. The signals of the seemingly monolithic interface, however, may actually be communicated between the separate die via serial and/or synchronous communication. In one method, a number of signals stored in a first parallel interface on a first integrated circuit die may be sampled. In some cases, at least one of the signals may be sampled more often than another one of the signals. A serial signal may be generated based on sampled signals. The serial signal may be transmitted to a corresponding second parallel interface on the second integrated circuit die.
    Type: Grant
    Filed: December 28, 2016
    Date of Patent: October 8, 2019
    Assignee: INTEL CORPORATION
    Inventors: David W. Mendel, Jeffrey Erik Schulz, Keith Duwel, Huy Ngo, Jakob Raymond Jones
  • Publication number: 20190112422
    Abstract: The invention relates to inorganic-organic hybrid materials comprising interpenetrated organic and inorganic components, wherein the organic component comprises polymer chains formed at least in part by ring-opening polymerization of a cyclic monomer, and processes for the production thereof.
    Type: Application
    Filed: March 31, 2017
    Publication date: April 18, 2019
    Inventors: Francesca Tallia, Julian Raymond Jones, Laura Francesca Cipolla, Laura Russo, Gloria Ruth Young