Patents by Inventor Raymond L. Chow

Raymond L. Chow has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Purge gas in wafer coating area selection
    Patent number: 5447570
    Abstract: Apparatus including a support and purge gas supply prevents edge and backside coating on a wafer in manufacture of integrated circuits. Various enclosure elements and methods are disclosed for containing and directing purge gas, and a CVD system is provided incorporating the elements of the invention.
    Type: Grant
    Filed: June 23, 1992
    Date of Patent: September 5, 1995
    Assignee: Genus, Inc.
    Inventors: Johannes J. Schmitz, Frederick J. Scholz, Norman L. Turner, Raymond L. Chow, Frank O. Uher, Sien G. Kang, Steven C. Selbrede
  • Film uniformity by selective pressure gradient control
    Patent number: 5387289
    Abstract: A system for depositing a film on a substrate in a CVD process has a second-source injection sub-system for injecting a control gas. The deposition rate of the material deposited in the CVD process is a function of the concentration of the control gas at the point that material is deposited. The second source injection sub-system provides a concentration gradient of the control gas relative to the substrate surface coated, and alters the thickness uniformity of the film. By controlling the gradient one may control the thickness uniformity profile. In another embodiment, the invention applies to dry etching with reactive gas, and the etching rate is controlled by second source provision of a control gas.
    Type: Grant
    Filed: September 22, 1992
    Date of Patent: February 7, 1995
    Assignee: Genus, Inc.
    Inventors: Johannes J. Schmitz, Raymond L. Chow, Sien G. Kang, Edward J. Rode, Frank O. Uher