Abstract: The invention relates to an automatic machine for bending the extending conductors of an integrated circuit chip to form contacts for mounting the chip to a substrate. This machine comprises a bending base (20), movable bending pieces (18, 19) situated opposite the bases, a ribbon insulating support (2) for the chip (1), and a platform (27) to displace the support of the chip so as to being the chip onto the base, or to remove it therefrom. This machine is characterized in that the bending base (20) includes a housing (21) having the form of the chip for receiving the chip and having a plane rim (23) adapted to surround the body of the chip. The first movable piece (18) is located in the second movable piece and has a flat rim (24) opposite the flat rim (23) of the base. The extending conductors are wedged during the bending operation between these two rims (23, 24) and the bending is carried out by the second movable piece (19) which moves rectilinearly in a vertical direction.

Abstract: A positioning system for electrical components to be mounted on a carrier includes establishing a first reference system and bringing the carrier on which the components are to be mounted to a predetermined position in relation to the first system. The locations for the articles to be mounted on the carrier are defined. A second reference system is established with respect to the first reference system and the carrier is positioned in relation to the articles to be mounted on the carrier using the second reference system. Each reference system is defined by at least three fixed points against which the carrier comes to bear and the points of the second reference system duplicate the points of the first reference system so that the carrier is in the exact position to enable the components to be mounted at the exact predetermined location.

Abstract: A tool for micro-soldering the connecting tags of an integrated circuit chip to corresponding terminals on a substrate by Joule heating includes a high conductivity bit having a planar bottom face adapted to contact the tags and press them against the terminals while applying sufficient heat to the tags to solder them to the terminals. The face has a perimeter and a centrally apertured portion adapted to receive and accommodate the circuit chip. The apertured portion forms a geometric loop on the planar face having opposite sides spaced from each other and adapted to contact the tags of the chip. A continuous high electrical conductivity flange extends upwardly from all portions of the perimeter of the face to provide rigidity to the bit.A pair of high conductivity strips extend from facing segments of the flange for applying current to and removing current from the flange on opposite sides of the loop so that a pair of symmetrical current half loops extend about the face between the opposite sides thereof.