Patents by Inventor Raymond L. Dietz
Raymond L. Dietz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8344523Abstract: Conductive compositions which are useful as thermally conductive compositions and may also be useful as electrically conductive compositions are provided. The compositions include a conductive particle constituent in combination with a sintering aid which can, for example be a compound of the same metal in the nanometal, an organo-metallic, a metalorganic salt, mercaptan and/or resinate. In some embodiments the conductive particles include a small amount of nanoscale (<200 nm) particles. The compositions exhibit increased thermal conductivity.Type: GrantFiled: July 30, 2009Date of Patent: January 1, 2013Assignee: Diemat, Inc.Inventors: Raymond L. Dietz, Maciej Patelka, Akito Yoshii, Pawel Czubarow, Takashi Sakamoto, Yukinari Abe
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Patent number: 7906373Abstract: Adhesive paste of polymer resin, fugitive liquid and particulate filler with round edges provides improved performance characteristics.Type: GrantFiled: March 26, 2008Date of Patent: March 15, 2011Inventors: Pawel Czubarow, Raymond L Dietz, Maciej Patelka
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Publication number: 20100065790Abstract: Conductive compositions which are useful as thermally conductive compositions and may also be useful as electrically conductive compositions are provided. The compositions include a conductive particle constituent in combination with a sintering aid which can, for example be a compound of the same metal in the nanometal, an organo-metallic, a metalorganic salt, mercaptan and/or resinate. In some embodiments the conductive particles include a small amount of nanoscale (<200 nm) particles. The compositions exhibit increased thermal conductivity.Type: ApplicationFiled: July 30, 2009Publication date: March 18, 2010Applicant: DIEMATInventors: Raymond L. Dietz, Maciej Patelka, Akito Yoshii, Pawel Czubarow, Takashi Sakamoto, Yukinari Abe
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Publication number: 20070256783Abstract: An adhesive paste with rounded filler particles results in improved thermal properties. The resultant compound maintains excellent quality for bonding high density, microcircuit electronic components to substrates.Type: ApplicationFiled: May 8, 2007Publication date: November 8, 2007Inventors: Raymond L. Dietz, Maciej Patelka
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Patent number: 6901203Abstract: A fiber optic feed-through tube, a method for making it and a method for hermetically sealing and aligning lightwave waveguides inserted into the tube. The feed-through tube is preferably a metal tube with low melting point hermetic sealing material deposited on one end and the lightwave waveguide is an optical glass fiber. The fiber is fed through a tube having low melting point hermetic sealing material on one end.Type: GrantFiled: November 8, 2002Date of Patent: May 31, 2005Assignee: Diemat, INCInventors: Pawl Czubarow, Raymond L. Dietz, Alexander Rogachevsky
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Patent number: 5663109Abstract: A metal/glass paste composition with a high metal to glass ratio and a method of using the paste to adhesively connect an integrated circuit to a ceramic substrate. The glass composition consists essentially of, by weight percent on an oxide basis:about 40-65% Ag.sub.2 Oabout 15-35% V.sub.2 O.sub.5about 0-30% PbO.sub.2about 0-20% TeO.sub.2The essentially resin-free paste utilizes the glass composition described above and, for a metallized ceramic substrate, has a metal:glass ratio of from about 8:1 up to about 11.5:1. For a bare (nonmetallized) ceramic substrate, the paste has a metal:glass ratio of from about 8:1 up to about 32:1.Type: GrantFiled: May 29, 1996Date of Patent: September 2, 1997Assignee: Quantum Materials, Inc.Inventors: Raymond L. Dietz, David M. Peck
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Patent number: 5543366Abstract: A glass composition and method of use having unique crystallization and crystal remelt properties is disclosed. The glass composition consists essentially by weight percent on an oxide basis:about 40-65% Ag.sub.2 Oabout 15-35% V.sub.2 O.sub.5about 0-30% PbO.sub.2about 0-20% TeO.sub.2The present invention also contemplates a unique, essentially resin-free organic system that utilizes the novel glass composition described above and has a ratio of silver to glass (solids) of from about 3 to 1 to about 8 to 1.Type: GrantFiled: June 27, 1994Date of Patent: August 6, 1996Assignee: Quantum Materials, Inc.Inventors: Raymond L. Dietz, David M. Peck
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Patent number: 5488082Abstract: Adhesive paste of organic polymer resin, inorganic filler and fugitive liquid can be used for die attach applications.Type: GrantFiled: February 17, 1995Date of Patent: January 30, 1996Assignee: Diemat, Inc.Inventors: Raymond L. Dietz, David M. Peck
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Patent number: 5391604Abstract: Adhesive paste of organic polymer resin, inorganic filler and fugitive liquid can be used for die attach applications.Type: GrantFiled: July 30, 1993Date of Patent: February 21, 1995Assignee: Diemat, Inc.Inventors: Raymond L. Dietz, David M. Peck
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Patent number: 5334558Abstract: A glass composition and method of use having unique crystallization and crystal remelt properties is disclosed. The glass composition consists essentially by weight percent on an oxide basis:about 40-65% Ag.sub.2 Oabout 15-35% V.sub.2 O.sub.5about 0-30% PbO.sub.2about 0-20% TeO.sub.2The present invention also contemplates a unique, essentially resin-free organic system that utilizes the novel glass composition described above.Type: GrantFiled: October 19, 1992Date of Patent: August 2, 1994Assignee: Diemat, Inc.Inventors: Raymond L. Dietz, David M. Peck
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Patent number: 5076876Abstract: A stable Tl.sub.2 O.sub.3, V.sub.2 O.sub.5, P.sub.2 O.sub.5 glass composition for a die attach paste requiring no resin and having a glassy edge temperature of below about 350.degree. C.Type: GrantFiled: February 21, 1990Date of Patent: December 31, 1991Assignee: Diemat, Inc.Inventor: Raymond L. Dietz
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Patent number: 4933030Abstract: A stable Tl.sub.2 O.sub.3, V.sub.2 O.sub.5, P.sub.2 O.sub.5 glass composition for a die attach paste requiring no resin and having a glassy edge temperature of below about 350.degree. C.Type: GrantFiled: June 21, 1989Date of Patent: June 12, 1990Inventor: Raymond L. Dietz
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Patent number: 4459166Abstract: A silver metallizing paste for attachment of silicon semi-conductive devices in lead-frame packages, specifically ceramic packages, which is less expensive than a gold preform but useable in hermetic packages, and provides better electrical and thermal conductivity, and higher bond strength, than silver polyimides. From 25 to 95% of silver is blended with a low-melting glass, preferably one having 95-96% PbO, and a paste or ink is formed with a suitable vehicle at 75-85% solids. Use of the paste follows conventional practice. Selection of Ag:glass ratio depends on the type of die bonding to be used. The paste is particularly useful in MOS technology, where low contact resistance is required, and also finds applications as a solder substitute and bonding chip capacitors. It is most advantageous in attachment of larger-area integrated circuits in that stress cracking associated with the gold-silicon eutectic is avoided.Type: GrantFiled: May 16, 1983Date of Patent: July 10, 1984Assignee: Johnson Matthey Inc.Inventors: Raymond L. Dietz, Michael Featherby, Peter K. Margetts
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Patent number: 4436785Abstract: A silver metallizing paste for attachment of silicon semi-conductive devices in lead-frame packages, specifically ceramic packages, which is less expensive than a gold preform but useable in hermetic packages, and provides better electrical and thermal conductivity, and higher bond strength, than silver polyimides. From 25 to 95% of silver is blended with a low-melting glass, preferably one having 95-96% PbO, and a paste or ink is formed with a suitable vehicle at 75-85% solids. Use of the paste follows conventional practice. Selection of Ag:glass ratio depends on the type of die bonding to be used. The paste is particularly useful in MOS technology, where low contact resistance is required, and also finds applications as a solder substitute and bonding chip capacitors. It is most advantageous in attachment of larger-area integrated circuits in that stress cracking associated with the gold-silicon eutectic is avoided.Type: GrantFiled: May 16, 1983Date of Patent: March 13, 1984Assignee: Johnson Matthey Inc.Inventors: Raymond L. Dietz, Michael Featherby, Peter K. Margetts
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Patent number: 4401767Abstract: A silver metallizing paste for attachment of silicon semi-conductive devices in lead-frame packages, specifically ceramic packages, which is less expensive than a gold preform but useable in hermetic packages, and provides better electrical and thermal conductivity, and higher bond strength, than silver polyimides. From 25 to 95% of silver is blended with a low-melting glass, preferably one having 95-96% PbO, and a paste or ink is formed with a suitable vehicle at 75-85% solids. Use of the paste follows conventional practice. Selection of Ag:glass ratio depends on the type of die bonding to be used. The paste is particularly useful in MOS technology, where low contact resistance is required, and also finds applications as a solder substitute and bonding chip capacitors. It is most advantageous in attachment of larger-area integrated circuits in that stress cracking associated with the gold-silicon eutectic is avoided.Type: GrantFiled: March 8, 1982Date of Patent: August 30, 1983Assignee: Johnson Matthey Inc.Inventors: Raymond L. Dietz, Michael Featherby, Peter K. Margetts
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Patent number: 4142203Abstract: Hermetically sealed unit containing an integrated circuit metal oxide semi-conductor chip, wherein a single layer gold-silver alloy serves both to secure the chip within the unit and to form a proper junction with the aluminum alloy conductor connected to a circuit element in said chip. A sufficient proportion of silver is included in the gold-silver alloy whereby said junction retains requisite operational characteristics of bond strength and low resistivity when said unit is subjected to heat for providing a hermetic seal therefor.Type: GrantFiled: December 20, 1976Date of Patent: February 27, 1979Assignee: AVX CorporationInventor: Raymond L. Dietz