Patents by Inventor Raymond Letize

Raymond Letize has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for the manufacture of printed circuit boards
    Patent number: 6656370
    Abstract: A process for the manufacture of printed circuit boards is disclosed wherein a plated silver deposit is used both as an etch resist and as a final finish for enhancing the solderability of the copper circuits. An aqueous alkaline etchant which is free of halide ions is proposed as being particularly compatible with the silver etch resist/final finish.
    Type: Grant
    Filed: October 13, 2000
    Date of Patent: December 2, 2003
    Inventors: Lenora Toscano, Raymond Letize
  • COMPOSITION AND METHOD FOR STRIPPING TIN OR TIN ALLOYS FROM METAL SURFACES
    Publication number: 20010007317
    Abstract: Tin or tin alloys, and any underlying copper-tin intermetallic, are stripped from copper surfaces utilizing an aqueous solution comprising nitric acid, sulfamic acid and a mono, di, or tri hydroxyl benzene.
    Type: Application
    Filed: February 17, 1999
    Publication date: July 12, 2001
    Applicant: MACDERMID, INCORPORATED
    Inventors: RAYMOND LETIZE, ROBERT HAMILTON
  • Photodefinable dielectric composition useful in the manufacture of printed circuits
    Patent number: 5763140
    Abstract: A composition and process useful in fabricating circuitry packages with permanent resists is proposed. The proposed composition comprises a carboxy functional resin, an acrylate oligomer, an epoxy functional resin, a butadiene nitrile resin, and a photoinitiator.
    Type: Grant
    Filed: February 10, 1997
    Date of Patent: June 9, 1998
    Assignee: MacDermid, Incorporated
    Inventors: Peter Kukanskis, Peter Gabriele, Raymond Letize, William Adams
  • Photodefinable dielectric composition useful in the manufacture of printed circuits
    Patent number: 5654126
    Abstract: A composition and process useful in fabricating circuitry packages with permanent resists is proposed. The proposed composition comprises a carboxy functional resin, an acrylate oligomer, an epoxy functional resin, a butadiene nitrile resin, and a photoinitiator.
    Type: Grant
    Filed: March 15, 1996
    Date of Patent: August 5, 1997
    Assignee: MacDermid, Incorporated
    Inventors: Peter Kukanskis, Peter Gabriele, Raymond Letize, William Adams
  • Process for creating circuitry on the surface of a photoimageable dielectric
    Patent number: 5648200
    Abstract: A process is proposed for creating circuitry on the surface of a photoimageable dielectric. Specifically the process uses electroless means with controlled pH and an organosilane conditioning agent to fabricate circuitry and interconnects directly upon the surface of a photoimageable dielectric, such circuitry and interconnects having good adhesion to and coverage of the dielectric surface.
    Type: Grant
    Filed: October 7, 1996
    Date of Patent: July 15, 1997
    Assignee: MacDermid, Incorporated
    Inventors: Raymond Letize, Peter Kukanskis
  • Photodefinable dielectric composition useful in the manufacture of printed circuits
    Patent number: 5545510
    Abstract: A composition and process useful in fabricating circuitry packages with permanent resists is proposed. The proposed composition comprises a carboxy functional resin, an acrylate oligomer, an epoxy functional resin, a butadiene nitrile resin, and a photoinitiator.
    Type: Grant
    Filed: March 28, 1995
    Date of Patent: August 13, 1996
    Assignee: Mac Dermid, Inc.
    Inventors: Peter Kukanskis, Peter Gabriele, Raymond Letize, William Adams