Abstract: A method and related apparatus for servicing an electrical/electronic device during power shut offs is provided. The apparatus comprises a service logic having a memory and control component for storing device information during normal device operation and one or more indicators driven by the memory and control component after power shut off to provide service signals. The service logic also includes an auxiliary energy source selectively engageable to provide auxiliary power to the memory and control component during power shut off and to enable providing of service signals through the indicator(s).

Abstract: Control of an AC-to-DC power supply assembly fed by a three-phase AC source is provided by: determining whether the power supply assembly includes greater than three single-phase power regulators feeding a common load, with multiple regulators being connected in parallel across a common phase of the AC source, and if so, summing currents provided by the regulators to the common load; and ascertaining whether the summed current is less than a predefined threshold, and if yes, operating the power supply assembly in a line balance mode to maintain power drawn on the phases of the AC source in balance, and if greater than the predefined threshold, operating the power supply assembly in a maximize power mode wherein power is provided to the common load without maintaining power drawn on the phases of the AC source in balance.

Abstract: A server including a cooling fan assembly and an input/output assembly at opposite ends of the server, and a processor assembly located between the cooling fan assembly and input/output assembly. The server also includes a cover plate that covers the processor assembly and cooling fan assembly and that has a power supply on the face of the cover plate facing the processor assembly and is electrically connected to the processor assembly.

Abstract: A server including a cooling fan assembly and an input/output assembly at opposite ends of the server, and a processor assembly located between the cooling fan assembly and input/output assembly. The server also includes a cover plate that covers the processor assembly and cooling fan assembly and that has a power supply on the face of the cover plate facing the processor assembly and is electrically connected to the processor assembly.

Abstract: A method and related apparatus for servicing an electrical/electronic device during power shut offs is provided. The apparatus comprises a service logic having a memory and control component for storing device information during normal device operation and one or more indicators driven by the memory and control component after power shut off to provide service signals. The service logic also includes an auxiliary energy source selectively engageable to provide auxiliary power to the memory and control component during power shut off and to enable providing of service signals through the indicator(s).

Abstract: A technique for testing an electronics assembly for a power short circuit is provided. The technique includes pre-characterizing power off resistance of an electronic component(s) of a first packaging level from at least one power boundary of the electronic component(s). The characterizing of the power off resistance occurs prior to placement of the electronic component(s) into an electronics assembly of a higher packaging level. The technique further includes determining actual power off resistance of the electronics component(s) after placement thereof into the electronics assembly, with the actual power off resistance being determined from the at least one power boundary. Thereafter, the actual power off resistance of the electronic component(s) in the electronics assembly is compared with the pre-characterized power off resistance of the at least one electronic component(s), and a determination is made therefrom whether a power short circuit exists within the electronics assembly.

Abstract: A technique for testing an electronics assembly for a power short circuit is provided. The technique includes pre-characterizing power off resistance of an electronic component(s) of a first packaging level from at least one power boundary of the electronic component(s). The characterizing of the power off resistance occurs prior to placement of the electronic component(s) into an electronics assembly of a higher packaging level. The technique further includes determining actual power off resistance of the electronics component(s) after placement thereof into the electronics assembly, with the actual power off resistance being determined from the at least one power boundary. Thereafter, the actual power off resistance of the electronic component(s) in the electronics assembly is compared with the pre-characterized power off resistance of the at least one electronic component(s), and a determination is made therefrom whether a power short circuit exists within the electronics assembly.

Abstract: A method and apparatus for measuring the temperature on an electronic chip. The Apparatus includes a thermal sense element on the chip, a power supply passing electrical current through said thermal sense element at a known voltage and temperature, and a measuring circuit determining the initial resistance of the thermal sense element at said known voltage and temperature. The measuring circuit measures the change of the resistance of the thermal sense element as the temperature of the electronic chip changes, and compares the change in resistance of the thermal sense element to the initial resistance. The measuring circuit determines the temperature of the electronic chip from the initial resistance and change in resistance of the thermal sense element during the operation of the electronic chip.

Abstract: A process of making a pigmented shaped article comprising: (a) providing polytrimethylene terephthalate chips and two or more colored pigmented chips each containing at least one different color pigment; (b) heating the polytrimethylene terephthalate chips and colored pigmented chips to a temperature of about 200-about 280° C. to melt the chips and form a polymer composition comprising the polytrimethylene terephthalate and at least one color pigment; and (c) forming a shaped article from the polymer composition.

Abstract: A method and apparatus for measuring the temperature on an electronic chip. The Apparatus includes a thermal sense element on the chip, a power supply passing electrical current through said thermal sense element at a known voltage and temperature, and a measuring circuit determining the initial resistance of the thermal sense element at said known voltage and temperature. The measuring circuit measures the change of the resistance of the thermal sense element as the temperature of the electronic chip changes, and compares the change in resistance of the thermal sense element to the initial resistance. The measuring circuit determines the temperature of the electronic chip from the initial resistance and change in resistance of the thermal sense element during the operation of the electronic chip.

Abstract: A process of making a pigmented shaped article comprising: (a) providing polytrimethylene terephthalate chips and two or more colored pigmented chips each containing at least one different color pigment; (b) heating the polytrimethylene terephthalate chips and colored pigmented chips to a temperature of about 200—about 280° C. to melt the chips and form a polymer composition comprising the polytrimethylene terephthalate and at least one color pigment; and (c) forming a shaped article from the polymer composition.

Abstract: An improved process for preparing pigmented drawn polyamide fibers is disclosed, the improvement being the improved processability obtained from the use of an N,N'-dialkyl polycarbonamide as a carrier polymer for the pigment dispersion.

Abstract: An improved process for preparing pigmented drawn polyamide fibers is disclosed, the improvement being the improved processability obtained from the use of an N,N'-dialkyl polycarbonamide as a carrier polymer for the pigment dispersion.

Abstract: An improved process for preparing polyamide hollow filaments wherein an N,N'-dialkyl polycarbonamide is melt blended with the molten fiber-forming polyamide prior to spinning into filaments. The polycarbonamide substantially decreases the collapsing of the voids which naturally occurs immediately .after spinning and before the filaments are completely cool.

Abstract: An improved process for preparing polyamide hollow filaments wherein an N,N'-dialkyl polycarbonamide is melt blended with the molten fiber-forming polyamide prior to spinning into filaments. The polycarbonamide substantially decreases the collapsing of the voids which naturally occurs immediately after spinning and before the filaments are completely cool.