Patents by Inventor Raymond M. Bryant

Raymond M. Bryant has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6676784
    Abstract: A process for the manufacture of a multilayer ceramic substrate includes fabricating the multilayer ceramic substrate from a monolith fabricated from universal layers and a monolith fabricated from custom layers. The universal layer monolith and the custom layer monolith are then joined to form the complete structure of the MLC substrate.
    Type: Grant
    Filed: July 17, 2001
    Date of Patent: January 13, 2004
    Assignee: International Business Machines Corporation
    Inventors: Christopher D. Setzer, Harsaran S. Bahatia, Raymond M. Bryant, Michael S. Cranmer, Suresh Kadakia, Richard O. Seeger, Satyapal Singh Bhatia
  • Publication number: 20030047352
    Abstract: A method of substrate design of an multilayer ceramic module that uses menu die of the same size is provided. One of these menu die provides a “generic” substrate design having internal wiring with greatest number of input/output (I/O) signal leads of all the dice available. Middle (redistribution) layers include electrical interconnections for both power and the I/O signal lead wires between the dice interface terminals and a bottom surface metallurgy (BSM) layer that has electrical connector pads by use of a customization layer.
    Type: Application
    Filed: September 7, 2001
    Publication date: March 13, 2003
    Applicant: International Business Machines Corporation
    Inventors: Harsaran S. Bhatia, Raymond M. Bryant, Suresh Kadakia, David C. Long, Paul R. Walling
  • Patent number: 6528735
    Abstract: A method of substrate design of a multilayer ceramic module that uses menu die of the same size. One of these menu die provides a “generic” substrate design having internal wiring with the greatest number of input/output (I/O) signal leads of all the dies available. Middle (redistribution) layers include electrical interconnections for both power and the I/O signal lead wires between the die interface terminals and a bottom surface metallurgy (BSM) layer that has electrical connector pads by use of a customization layer.
    Type: Grant
    Filed: September 7, 2001
    Date of Patent: March 4, 2003
    Assignee: International Business Machines Corporation
    Inventors: Harsaran S. Bhatia, Raymond M. Bryant, Suresh Kadakia, David C. Long, Paul R. Walling
  • Publication number: 20030015277
    Abstract: A process for the manufacture of a multilayer ceramic substrate includes fabricating the multilayer ceramic substrate from a monolith fabricated from universal layers and a monolith fabricated from custom layers. The universal layer monolith and the custom layer monolith are then joined to form the complete structure of the MLC substrate.
    Type: Application
    Filed: July 17, 2001
    Publication date: January 23, 2003
    Applicant: International Business Machines Corporation
    Inventors: Christopher D. Setzer, Harsaran S. Bahatia, Raymond M. Bryant, Michael S. Cranmer, Suresh Kadakia, Richard O. Seeger, Satyapal Singh Bhatia
  • Patent number: 6434575
    Abstract: A method and apparatus for instrumenting garbage collection in a data processing system is provided. During garbage collection, a pass is made through the object heap and a plurality of heap data is retrieved and written to a trace file. The data may include the type of object, the size of the object on the heap, the class of the object, if appropriate, and a plurality of pointers, including live set pointers, and one or more tags representing attributes that may be associated with the particular object. The instrumentation may controlled to occur at a preselected phase of the garbage collection process. Additionally, a user may dynamically initiate a garbage collection instrumentation if the user determines that an event has occurred during the operation of the data processing system about which the user wishes further data.
    Type: Grant
    Filed: November 12, 1998
    Date of Patent: August 13, 2002
    Assignee: International Business Machines Corporation
    Inventors: Robert Francis Berry, Raymond M. Bryant, Weiming Gu, John Day Howard, William Robert Reynolds, Robert J. Urquhart