Patents by Inventor Raymond M. Rademeyer

Raymond M. Rademeyer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Laminated forming dies
    Patent number: 9032774
    Abstract: One aspect of the disclosure relates to a die comprising a primary plate and secondary plates. The secondary plates comprise through weld holes formed along a direction. The through weld holes of adjacent secondary plates do not overlap when viewed in the direction along which the though weld holes are formed. The primary plate is coupled to at least one secondary plate abutting the primary plate by first welds located in the through weld holes. The secondary plates abutting each other are coupled by second welds located in the through weld holes.
    Type: Grant
    Filed: December 13, 2013
    Date of Patent: May 19, 2015
    Assignee: The Boeing Company
    Inventors: Ryan L. Hanks, Raymond M. Rademeyer, Larry D. Hefti, Steve R. McNamara