Patents by Inventor Raymond Maldan Partosa

Raymond Maldan Partosa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Making a flip-chip assembly with bond fingers
    Patent number: 9219052
    Abstract: A method of making a flip chip assembly includes a substrate having a top surface and forming a plurality of generally longitudinally extending, laterally spaced apart bond fingers are formed on the top surface. Each of the plurality of bond fingers has a first longitudinal end portion and a second longitudinal end portion. Applying a transversely extending solder resist strip over the first longitudinal end portions of the bond fingers. The strip has an edge wall with a plurality of longitudinally projecting tooth portions separated by gaps. Each tooth portion and each gap aligned with a different one of the bond fingers in each adjacent pair of bond fingers.
    Type: Grant
    Filed: May 15, 2014
    Date of Patent: December 22, 2015
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Raymond Maldan Partosa, Jesus Bajo Bautista, James Raymond Baello, Roxanna Bauzon Samson
  • MAKING A FLIP-CHIP ASSEMBLY WITH BOND FINGERS
    Publication number: 20140248746
    Abstract: A method of making a flip chip assembly includes a substrate having a top surface and forming a plurality of generally longitudinally extending, laterally spaced apart bond fingers are formed on the top surface. Each of the plurality of bond fingers has a first longitudinal end portion and a second longitudinal end portion. Applying a transversely extending solder resist strip over the first longitudinal end portions of the bond fingers. The strip has an edge wall with a plurality of longitudinally projecting tooth portions separated by gaps. Each tooth portion and each gap aligned with a different one of the bond fingers in each adjacent pair of bond fingers.
    Type: Application
    Filed: May 15, 2014
    Publication date: September 4, 2014
    Applicant: Texas Instruments Incorporated
    Inventors: Raymond Maldan Partosa, Jesus Bajo Bautista, James Raymond Baello, Roxanna Bauzon Samson
  • SUBSTRATE WITH BOND FINGERS
    Publication number: 20140197534
    Abstract: A flip chip mounting board includes a substrate having a top surface and a plurality of generally parallel, longitudinally extending, laterally spaced apart bond fingers are formed on the top surface. Each of the plurality of bond fingers has a first longitudinal end portion and a second longitudinal end portion. A first strip of laterally extending solder resist material overlies the first longitudinal end portions of the bond fingers. The first strip has an edge wall with a plurality of longitudinally projecting tooth portions separated by gaps with a longitudinally extending tooth portion being aligned with every other one of the bond fingers. Adjacent bond fingers have first end portions covered by different longitudinal lengths of solder resist material.
    Type: Application
    Filed: January 16, 2013
    Publication date: July 17, 2014
    Applicant: Texas Instruments Incorporated
    Inventors: Raymond Maldan Partosa, Jesus Bajo Bautista, JR., James Raymond Baello, Roxanna Bauzon Samson
  • Bonding a solder bump to a lead using compression and retraction forces
    Patent number: 8381967
    Abstract: Methods of connecting solder bumps located on dies to leads located on substrates are disclosed herein. One embodiment includes applying a first compression force between the solder bump and the lead; relieving the first compression force between the solder bump and the lead; and applying a second compression force between the solder bump and the lead.
    Type: Grant
    Filed: January 5, 2012
    Date of Patent: February 26, 2013
    Assignee: Texas Instruments Incorporated
    Inventors: Mutsumi Masumoto, Jesus Bajo Bautista, Jr., Raymond Maldan Partosa, James Raymond Baello