Patents by Inventor Raymond McKay Featherstone

Raymond McKay Featherstone has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11932185
    Abstract: Control methods and systems including a smart vehicle, a smart mobile device including a processor, a memory communicatively coupled to the processor, and machine readable instructions stored in the memory that may cause a system to perform at least the following when executed by the processor: use the smart mobile device to automatically control functionality of smart features of the smart vehicle based on an applied control logic and environmental inputs and/or use the smart mobile device to automatically control a wireless routing selection between a local area network associated with the smart vehicle and a remote wide area network based on an application tool switch logic.
    Type: Grant
    Filed: April 12, 2023
    Date of Patent: March 19, 2024
    Assignee: Thor Tech, Inc.
    Inventors: Ciprian R. Sandu, Jason T. Kriesel, Raymond McKay Featherstone, Edward Brady, Steven Hileman
  • Patent number: 6646207
    Abstract: A method and apparatus for providing a flat cable assembly in which two or more flat cable sub-assemblies having respective non-orthogonal proximate terminations and respective non-orthogonal distal terminations are adapted to form a substantially straight helix structure providing a self-supporting cable assembly while reducing mechanical stresses on termination points.
    Type: Grant
    Filed: May 12, 2000
    Date of Patent: November 11, 2003
    Assignee: Thomson Licensing S. A.
    Inventor: Raymond McKay Featherstone, III
  • Patent number: 6351385
    Abstract: An integrated circuit heat dissipator is comprised of a unitary piece of metallic material for dissipating thermal energy generated by semiconductor devices encapsulated in a DIP integrated circuit package. The heat dissipator is adapted to accept heat conducting pins of the integrated circuit. Soldering secures the heat dissipator and the integrated circuit heat conducting pins to each other and to the printed circuit board. A bulk mass of heat conducting solder is retained at the connection of the heat dissipator and the heat conducting pins for enhancing the heat sinking of the pins by the heat dissipator.
    Type: Grant
    Filed: September 26, 2000
    Date of Patent: February 26, 2002
    Assignee: Thomson Licensing, S.A.
    Inventor: Raymond McKay Featherstone, III
  • Patent number: D813101
    Type: Grant
    Filed: December 3, 2015
    Date of Patent: March 20, 2018
    Assignee: Thor Tech, Inc.
    Inventors: James Jack Owen Devine, Dale Beever, Raymond McKay Featherstone, Bryan M. Fox, Dana Kim Gehman, Bradley J. Mitchell, Robert Owen Sanford, Bryan Thompson
  • Patent number: D864033
    Type: Grant
    Filed: February 2, 2018
    Date of Patent: October 22, 2019
    Assignee: Thor Tech, Inc.
    Inventors: James Jack Owen Devine, Dale Beever, Raymond McKay Featherstone, Bryan M. Fox, Dana Kim Gehman, Bradley J. Mitchell, Robert Owen Sanford, Bryan Thompson
  • Patent number: D955924
    Type: Grant
    Filed: September 5, 2019
    Date of Patent: June 28, 2022
    Assignee: Thor Tech, Inc.
    Inventors: James Jack Owen Devine, Dale Beever, Raymond McKay Featherstone, Bryan M. Fox, Dana Kim Gehman, Bradley J. Mitchell, Robert Owen Sanford, Bryan Thompson
  • Patent number: D993087
    Type: Grant
    Filed: May 20, 2022
    Date of Patent: July 25, 2023
    Assignee: Thor Tech, Inc.
    Inventors: James Jack Owen Devine, Dale Beever, Raymond McKay Featherstone, Bryan M. Fox, Dana Kim Gehman, Bradley J. Mitchell, Robert Owen Sanford, Bryan Thompson