Abstract: Embodiments generally relate to methods for bonding a cap to a substrate. In one embodiment, the method comprises first providing a ring-cap assembly, comprising a cap and an interposer ring comprising a ring material transparent at an illumination wavelength. A peripheral portion of the ring projects outwards beyond the overlying cap. The portion of the ring bottom surface underlying the projecting peripheral portion of the ring comprises a plurality of downwardly extending fingers. The method further comprises positioning the ring-cap assembly so that the plurality of fingers directly overlies predetermined portions of the substrate top substrate, creating a first bond between a first one of the plurality of fingers and a corresponding first predetermined portion of the substrate top surface, while illuminating and observing the first predetermined portion at the illumination wavelength through the projecting peripheral portion of the ring to determine a quality measure of that first bond.

Abstract: A method of fabricating a liquid lens array creates an array of through holes of axisymmetric cross-section through a central plate, forms conductive traces on the side walls of each of the through holes and on a portion of the top and bottom surfaces of the central plate contiguous with each through hole, and bonds the bottom surface of the central plate around each through hole to the top surface of a transparent base plate, forming an array of cavities. The method applies an insulating layer to the side walls of each cavity, portions of the top surface of the base plate lying within each cavity, and portions of the top surface of the transparent central plate surrounding each cavity, introduces a polar liquid and a non-polar liquid into each cavity; and bonds the top surface of the central plate to the bottom surface of a transparent top plate.

Abstract: Embodiments generally relate to methods for forming and dismantling a hermetically sealed chamber. In one embodiment, the method comprises using room temperature laser bonding to create a hermetic seal between a first element and a second element to form a chamber. A bond interface of the hermetic seal is configured to allow the hermetic seal to be opened under controlled conditions using a release technique. In one embodiment, the chamber is formed within a microfluidic chip and the chamber is configured to hold a fluid. In one embodiment a chip comprises a first hermetic seal bonding first and second elements to create a first chamber and a second hermetic seal bonding third and fourth elements to create a second chamber encompassing the first chamber. The first hermetic seal may be broken open independently of the second hermetic seal by the application of a mechanical or thermal technique.

Abstract: Embodiments generally relate to heat pipes and methods for fabricating the same. In one embodiment, the heat pipe comprises a first section bonded to a second section such that a first channel is enclosed therebetween; and a liquid partly filling the first channel. The bonded first and second sections comprise a first area configured to be bonded to a heat-generating device and a second area configured to be bonded to a heat sink. The first channel is characterized by a first portion within the first area and a second portion within the second area. The liquid and at least one of the first section and the second section are transparent at a wavelength emitted by the heat-generating device.

Abstract: Embodiments generally relate to heat pipes and methods for fabricating the same. In one embodiment, the heat pipe comprises a first section bonded to a second section such that a first channel is enclosed therebetween; and a liquid partly filling the first channel. The bonded first and second sections comprise a first area configured to be bonded to a heat-generating device and a second area configured to be bonded to a heat sink. The first channel is characterized by a first portion within the first area and a second portion within the second area. The liquid and at least one of the first section and the second section are transparent at a wavelength emitted by the heat-generating device.

Abstract: A method of fabricating a liquid lens array creates an array of through holes of axisymmetric cross-section through a central plate, forms conductive traces on the side walls of each of the through holes and on a portion of the top and bottom surfaces of the central plate contiguous with each through hole, and bonds the bottom surface of the central plate around each through hole to the top surface of a transparent base plate, forming an array of cavities. The method applies an insulating layer to the side walls of each cavity, portions of the top surface of the base plate lying within each cavity, and portions of the top surface of the transparent central plate surrounding each cavity, introduces a polar liquid and a non-polar liquid into each cavity; and bonds the top surface of the central plate to the bottom surface of a transparent top plate.

Abstract: A method of fabricating a liquid lens array creates an array of through holes of axisymmetric cross-section through a central plate, forms conductive traces on the side walls of each of the through holes and on a portion of the top and bottom surfaces of the central plate contiguous with each through hole, and bonds the bottom surface of the central plate around each through hole to the top surface of a transparent base plate, forming an array of cavities. The method applies an insulating layer to the side walls of each cavity, portions of the top surface of the base plate lying within each cavity, and portions of the top surface of the transparent central plate surrounding each cavity, introduces a polar liquid and a non-polar liquid into each cavity; and bonds the top surface of the central plate to the bottom surface of a transparent top plate.

Abstract: A method of fabricating a liquid lens array creates an array of through holes of axisymmetric cross-section through a central plate, forms conductive traces on the side walls of each of the through holes and on a portion of the top and bottom surfaces of the central plate contiguous with each through hole, and bonds the bottom surface of the central plate around each through hole to the top surface of a transparent base plate, forming an array of cavities. The method applies an insulating layer to the side walls of each cavity, portions of the top surface of the base plate lying within each cavity, and portions of the top surface of the transparent central plate surrounding each cavity, introduces a polar liquid and a non-polar liquid into each cavity; and bonds the top surface of the central plate to the bottom surface of a transparent top plate.

Abstract: Embodiments generally relate to methods for bonding a cap to a substrate. In one embodiment, the method comprises first providing a ring-cap assembly, comprising a cap and an interposer ring comprising a ring material transparent at an illumination wavelength. A peripheral portion of the ring projects outwards beyond the overlying cap. The portion of the ring bottom surface underlying the projecting peripheral portion of the ring comprises a plurality of downwardly extending fingers. The method further comprises positioning the ring-cap assembly so that the plurality of fingers directly overlies predetermined portions of the substrate top substrate, creating a first bond between a first one of the plurality of fingers and a corresponding first predetermined portion of the substrate top surface, while illuminating and observing the first predetermined portion at the illumination wavelength through the projecting peripheral portion of the ring to determine a quality measure of that first bond.

Abstract: A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.

Abstract: A reflective grating for precision location measurement. In one embodiment, the reflective grating has a non-reflective substrate and a non-reflective adhesion layer disposed on the substrate layer. A reflective surface layer is disposed on the adhesion layer. In another embodiment, the reflective grating is manufactured on the reflective (polished) surface of a monolithic substrate. A series of grating lines are formed in the reflective surface layer by vaporizing portions of the reflective surface layer with a laser in order to expose the non-reflective adhesion layer. Accordingly, alternating reflective and non-reflective grating lines are formed that are used for making precision measurements.