Patents by Inventor Raymond P. Scholer

Raymond P. Scholer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor reliability test chip
    Patent number: 6770906
    Abstract: A semiconductor test chip including a plurality of test functions. The test functions of the semiconductor test chip include bond pad pitch and size effects on chip design, wire bond placement accuracy regarding placement of the wire bond on the bond pad, evaluation of bond pad damage (cratering) effect on the area of the chip below the bond pad during bonding of the wire on the bond pad, street width effects regarding the use of thinner saw cuts in cutting the individual chips from the wafer, thermal impedance effects for thermal testing capabilities, ion mobility evaluation capabilities and chip on board in flip chip application test capabilities.
    Type: Grant
    Filed: February 19, 2003
    Date of Patent: August 3, 2004
    Assignee: Micron Technology, Inc.
    Inventors: Tim J. Corbett, Raymond P. Scholer, Fernando Gonzalez
  • Semiconductor reliability test chip
    Publication number: 20030151047
    Abstract: A semiconductor test chip including a plurality of test functions. The test functions of the semiconductor test chip include bond pad pitch and size effects on chip design, wire bond placement accuracy regarding placement of the wire bond on the bond pad, evaluation of bond pad damage (cratering) effect on the area of the chip below the bond pad during bonding of the wire on the bond pad, street width effects regarding the use of thinner saw cuts in cutting the individual chips from the wafer, thermal impedance effects for thermal testing capabilities, ion mobility evaluation capabilities and chip on board in flip chip application test capabilities.
    Type: Application
    Filed: February 19, 2003
    Publication date: August 14, 2003
    Inventors: Tim J. Corbett, Raymond P. Scholer, Fernando Gonzalez
  • Semiconductor reliability test chip
    Patent number: 6538264
    Abstract: A semiconductor test chip including a plurality of test functions. The test functions of the semiconductor test chip include bond pad pitch and size effects on chip design, wire bond placement accuracy regarding placement of the wire bond on the bond pad, evaluation of bond pad damage (cratering) effect on the area of the chip below the bond pad during bonding of the wire on the bond pad, street width effects regarding the use of thinner saw cuts in cutting the individual chips from the wafer, thermal impedance effects for thermal testing capabilities, ion mobility evaluation capabilities and chip on board in flip chip application test capabilities.
    Type: Grant
    Filed: August 28, 2001
    Date of Patent: March 25, 2003
    Assignee: Micron Technology, Inc.
    Inventors: Tim J. Corbett, Raymond P. Scholer, Fernando Gonzalez
  • Semiconductor reliability test chip
    Publication number: 20020024046
    Abstract: A semiconductor test chip including a plurality of test functions. The test functions of the semiconductor test chip include bond pad pitch and size effects on chip design, wire bond placement accuracy regarding placement of the wire bond on the bond pad, evaluation of bond pad damage (cratering) effect on the area of the chip below the bond pad during bonding of the wire on the bond pad, street width effects regarding the use of thinner saw cuts in cutting the individual chips from the wafer, thermal impedance effects for thermal testing capabilities, ion mobility evaluation capabilities and chip on board in flip chip application test capabilities.
    Type: Application
    Filed: August 28, 2001
    Publication date: February 28, 2002
    Inventors: Tim J. Corbett, Raymond P. Scholer, Fernando Gonzalez
  • Semiconductor reliability test chip
    Patent number: 6320201
    Abstract: A semiconductor test chip including a plurality of test functions. The test functions of the semiconductor test chip include bond pad pitch and size effects on chip design, wire bond placement accuracy regarding placement of the wire bond on the bond pad, evaluation of bond pad damage (cratering) effect on the area of the chip below the bond pad during bonding of the wire on the bond pad, street width effects regarding the use of thinner saw cuts in cutting the individual chips from the wafer, thermal impedance effects for thermal testing capabilities, ion mobility evaluation capabilities and chip on board in flip chip application test capabilities.
    Type: Grant
    Filed: July 20, 2000
    Date of Patent: November 20, 2001
    Assignee: Micron Technology, Inc.
    Inventors: Tim J. Corbett, Raymond P. Scholer, Fernando Gonzalez
  • Semiconductor reliability test chip
    Patent number: 6157046
    Abstract: A semiconductor test chip including a plurality of test functions. The test functions of the semiconductor test chip include bond pad pitch and size effects on chip design, wire bond placement accuracy regarding placement of the wire bond on the bond pad, evaluation of bond pad damage (cratering) effect on the area of the chip below the bond pad during bonding of the wire on the bond pad, street width effects regarding the use of thinner saw cuts in cutting the individual chips from the wafer, thermal impedance effects for thermal testing capabilities, ion mobility evaluation capabilities and chip on board in flip chip application test capabilities.
    Type: Grant
    Filed: April 23, 1999
    Date of Patent: December 5, 2000
    Assignee: Micron Technology, Inc.
    Inventors: Tim J. Corbett, Raymond P. Scholer, Fernando Gonzalez
  • Semiconductor reliability test chip
    Patent number: 5936260
    Abstract: A semiconductor test chip including a plurality test functions. The test functions of the semiconductor test chip include bond pad pitch and size effects on chip design, wire bond placement accuracy regarding placement of the wire bond on the bond pad, evaluation of bond pad damage (cratering) effect on the area of the chip below the bond pad during bonding of the wire on the bond pad, street width effects regarding the use of thinner saw cuts in cutting the individual chips from the wafer, thermal impedance effects for thermal testing capabilities, ion mobility evaluation capabilities and chip on board in flip chip application test capabilities.
    Type: Grant
    Filed: August 21, 1997
    Date of Patent: August 10, 1999
    Assignee: Micron Technology, Inc.
    Inventors: Tim J. Corbett, Raymond P. Scholer, Fernando Gonzalez
  • Semiconductor reliability test chip
    Patent number: 5751015
    Abstract: A semiconductor test chip including a plurality of test functions. The test functions of the semiconductor test chip include bond pad pitch and size effects on chip design, wire bond placement accuracy regarding placement of the wire bond on the bond pad, evaluation of bond pad damage (cratering) effect on the area of the chip below the bond pad during bonding of the wire on the bond pad, street width effects regarding the use of thinner saw cuts in cutting the individual chips from the wafer, thermal impedance effects for thermal testing capabilities, ion mobility evaluation capabilities and chip on board in flip chip application test capabilities.
    Type: Grant
    Filed: November 17, 1995
    Date of Patent: May 12, 1998
    Assignee: Micron Technology, Inc.
    Inventors: Tim J. Corbett, Raymond P. Scholer, Fernando Gonzalez