Patents by Inventor Raymond Prew
Raymond Prew has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8109770Abstract: An intercoupling component for receiving an array of contacts within a digital or analog transmission system having an electrical ground circuit and chassis ground circuit, the intercoupling component may include a segment formed of electrically insulative material and having an upper and lower surface, the segment including a plurality of holes disposed on its upper surface and arranged in a predetermined footprint, one or more a shield members formed of electrically conductive material disposed within the segment and configured to connect to the chassis ground circuit of the system and a frame formed of electrically conductive material and configured to connect with the chassis ground circuit of the system. The intercoupling component may include an array of electrically conductive contacts grouped to multi-contact groupings configured to transmit single-ended or differential signals.Type: GrantFiled: April 4, 2006Date of Patent: February 7, 2012Assignee: Advanced Interconnections Corp.Inventors: Michael N. Perugini, Gary D. Eastman, Alfred J. Langon, Raymond A. Prew, Erol D. Saydam
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Publication number: 20060240688Abstract: An intercoupling component for receiving an array of contacts within a digital or analog transmission system having an electrical ground circuit and chassis ground circuit, the intercoupling component may include a segment formed of electrically insulative material and having an upper and lower surface, the segment including a plurality of holes disposed on its upper surface and arranged in a predetermined footprint, one or more a shield members formed of electrically conductive material disposed within the segment and configured to connect to the chassis ground circuit of the system and a frame formed of electrically conductive material and configured to connect with the chassis ground circuit of the system. The intercoupling component may include an array of electrically conductive contacts grouped to multi-contact groupings configured to transmit single-ended or differential signals.Type: ApplicationFiled: April 4, 2006Publication date: October 26, 2006Inventors: Michael Perugini, Gary Eastman, Alfred Langon, Raymond Prew, Erol Saydam
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Patent number: 7021945Abstract: An intercoupling component for receiving an array of contacts within a digital or analog transmission system having an electrical ground circuit and chassis ground circuit, the intercoupling component including a segment formed of electrically insulative material and having an upper and lower surface, the segment including a plurality of holes disposed on its upper surface and arranged in a predetermined footprint and one or more a shield members formed of electrically conductive material disposed within the segment and configured to connect to the chassis ground circuit of the system. The intercoupling component may include an array of electrically conductive contacts within the plurality of holes disposed on the segment. One or more of these contacts may be configured to electrically connect with the electrical ground circuit of the system. The intercoupling component may also include a cavity located between signal contacts to adjust the differential impedance between signal contacts.Type: GrantFiled: April 8, 2004Date of Patent: April 4, 2006Assignee: Advanced Interconnection CorporationInventors: Michael N. Perugini, Gary D. Eastman, Alfred J. Langon, Raymond A. Prew, Erol D. Saydam
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Patent number: 6899550Abstract: An intercoupling component for receiving an array of contacts includes a non-conductive substrate having a plurality of holes disposed on its upper surface and arranged in a predetermined footprint corresponding to the array of contacts. Contacts are disposed within the holes and a cavities, which may be open to air or filled with some other dielectric material, are disposed in the substrate between adjacent contacts.Type: GrantFiled: February 25, 2004Date of Patent: May 31, 2005Assignee: Advanced Interconnections CorporationInventors: Michael N. Perugini, Gary D. Eastman, Alfred J. Langon, Raymond A. Prew, Erol D. Saydam
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Publication number: 20040192089Abstract: An intercoupling component for receiving an array of contacts within a digital or analog transmission system having an electrical ground circuit and chassis ground circuit, the intercoupling component including a segment formed of electrically insulative material and having an upper and lower surface, the segment including a plurality of holes disposed on its upper surface and arranged in a predetermined footprint and one or more a shield members formed of electrically conductive material disposed within the segment and configured to connect to the chassis ground circuit of the system. The intercoupling component may include an array of electrically conductive contacts within the plurality of holes disposed on the segment. One or more of these contacts may be configured to electrically connect with the electrical ground circuit of the system. The intercoupling component may also include a cavity located between signal contacts to adjust the differential impedance between signal contacts.Type: ApplicationFiled: April 8, 2004Publication date: September 30, 2004Applicant: Advanced Interconnections Corporation, a Rhode Island corporationInventors: Michael N. Perugini, Gary D. Eastman, Alfred J. Langon, Raymond A. Prew, Erol D. Saydam
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Publication number: 20040166704Abstract: An intercoupling component for receiving an array of contacts includes a non-conductive substrate having a plurality of holes disposed on its upper surface and arranged in a predetermined footprint corresponding to the array of contacts. Contacts are disposed within the holes and a cavities, which may be open to air or filled with some other dielectric material, are disposed in the substrate between adjacent contacts.Type: ApplicationFiled: February 25, 2004Publication date: August 26, 2004Applicant: Advanced Interconnections Corporation, a Rhode Island corporationInventors: Michael N. Perugini, Gary D. Eastman, Alfred J. Langon, Raymond A. Prew, Erol D. Saydam
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Patent number: 6743049Abstract: An intercoupling component for receiving an array of contacts within a digital or analog transmission system having an electrical ground circuit and chassis ground circuit, the intercoupling component may include a segment formed of electrically insulative material and having an upper and lower surface, the segment including a plurality of holes disposed on its upper surface and arranged in a predetermined footprint, one or more a shield members formed of electrically conductive material disposed within the segment and configured to connect to the chassis ground circuit of the system and a frame formed of electrically conductive material and configured to connect with the chassis ground circuit of the system. The intercoupling component may include an array of electrically conductive contacts grouped to multi-contact groupings configured to transmit single-ended or differential signals.Type: GrantFiled: June 24, 2002Date of Patent: June 1, 2004Assignee: Advanced Interconnections CorporationInventors: Michael N. Perugini, Gary D. Eastman, Alfred J. Langdon, Raymond A. Prew, Erol D. Saydam
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Publication number: 20030236031Abstract: An intercoupling component for receiving an array of contacts within a digital or analog transmission system having an electrical ground circuit and chassis ground circuit, the intercoupling component including a segment formed of electrically insulative material and having an upper and lower surface, the segment including a plurality of holes disposed on its upper surface and arranged in a predetermined footprint and one or more a shield members formed of electrically conductive material disposed within the segment and configured to connect to the chassis ground circuit of the system. The intercoupling component may include an array of electrically conductive contacts within the plurality of holes disposed on the segment. One or more of these contacts may be configured to electrically connect with the electrical ground circuit of the system. The intercoupling component may also include a cavity located between signal contacts to adjust the differential impedance between signal contacts.Type: ApplicationFiled: June 24, 2002Publication date: December 25, 2003Inventors: Michael N. Perugini, Gary D. Eastman, Alfred J. Langon, Raymond A. Prew, Erol D. Saydam
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Patent number: 4187971Abstract: A stapler of the type having a top cover member and lever member mounted for pivotal movement between an operative position disposed in closing relation with the open top of the magazine chamber of a magazine member and a staple stick loading position displaced approximately 180.degree., a staple stick pusher mounted slidable on a mounting rod within the magazine chamber and a flexible elongated pusher retracting member molded of plastic material having one end portion abutting the pusher apertured to receive the rod therethrough and the opposite end formed with a disk-shaped head insertable through an elongated slot in the top cover member so as to move within a space defined by the top cover member and the lever member.Type: GrantFiled: June 29, 1978Date of Patent: February 12, 1980Assignee: Textron Inc.Inventor: Raymond A. Prew, Jr.