Patents by Inventor Raymond R. Jin

Raymond R. Jin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chemical mechanical polishing a substrate having a filler layer and a stop layer
    Patent number: 7201636
    Abstract: A substrate is chemical mechanical polished with a high-selectivity slurry until the stop layer is at least partially exposed, and then the substrate is polished with a low-selectivity slurry until the stop layer is completely exposed.
    Type: Grant
    Filed: March 8, 2005
    Date of Patent: April 10, 2007
    Assignee: Applied Materials, Inc.
    Inventors: Raymond R. Jin, Shijian Li, Fred C. Redeker, Thomas H. Osterheld
  • Chemical mechanical polishing a substrate having a filler layer and a stop layer
    Patent number: 6863593
    Abstract: A substrate is chemical mechanical polished with a high-selectivity slurry until the stop layer is at least partially exposed, and then the substrate is polished with a low-selectivity slurry until the stop layer is completely exposed.
    Type: Grant
    Filed: November 2, 1998
    Date of Patent: March 8, 2005
    Assignee: Applied Materials, Inc.
    Inventors: Raymond R. Jin, Shijian Li, Fred C. Redeker, Thomas H. Osterheld
  • Chemical mechanical polishing processes and components
    Patent number: 6435942
    Abstract: A substrate is chemical mechanical polished first with a single layer hard polishing pad and a high-selectivity slurry until a first endpoint is reached, and then with a soft polishing pad and a low-selectivity slurry until a second endpoint is reached. Dishing is reduced when low-selectivity slurry is used at the second polishing step. Low Within-Wafer-Non-Uniformity is achieved by using a single layer hard pad at low pressure at the first polishing step.
    Type: Grant
    Filed: February 11, 2000
    Date of Patent: August 20, 2002
    Assignee: Applied Materials, Inc.
    Inventors: Raymond R Jin, Jeffrey Drue David, Fred C Redeker, Thomas H Osterheld