Abstract: A wire bundle including a plurality of insulated wires forming a bundle having a chosen length, wherein the wires are disposed substantially parallel to one another and are joined together along the chosen length by a connecting material which is capable of being torn without the use of tools, such that the wires can be separated from one another without affecting the insulation thereof along at least a portion of the chosen length is described. Such a wire bundle permits the connection of wires to integrated circuits having small-pitch connection pins to be more readily made. By forming an electrical contact between one wire in the wire bundle and a connector pin of the integrated circuit by soldering, as an example of a connection process, the other wires in the bundle are automatically aligned and stabilized with respect to the other connector pins of the integrated circuit. Soldering of these other connections can then be more readily accomplished.