Patents by Inventor Raymond S. Bregante

Raymond S. Bregante has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Air cavity package with supplemental heat generator
    Patent number: 10705548
    Abstract: An air cavity package having a supplemental heat generator for generating heat and a pressure greater than atmospheric pressure within the air cavity package. The supplemental heat generator may be maintained at a constant or variable temperature. The supplemental heat generator may be selectively activated based on a predetermined parameter by a user or by a processor. The supplemental heat generator may be an RF and or other chip capable of generating heat or a conductive wire.
    Type: Grant
    Filed: February 23, 2018
    Date of Patent: July 7, 2020
    Assignee: RJR Technologies, Inc.
    Inventors: Raymond S. Bregante, Alex Elliott
  • Use of diverse materials in air-cavity packaging of electronic devices
    Patent number: 6511866
    Abstract: Semiconductor circuit devices (dies) are incorporated into moisture-impenetrable electronic packages by forming enclosures around the die in three separate parts—base, sidewalls, and lid. The die is first soldered or otherwise bonded to the base, followed by attachment of the sidewalls to the base, and finally the lid to the sidewalls. For procedures involving a heat-conductive base and a high soldering temperature, the die can be secured to the base at the high soldering temperature, followed by application of the sidewalls to the base at a significantly lower temperature, avoiding potential high-temperature damage to the sidewalls. Plastic sidewalls which would otherwise deteriorate or become distorted upon exposure to the high soldering temperature can thus be used.
    Type: Grant
    Filed: July 12, 2001
    Date of Patent: January 28, 2003
    Assignee: RJR Polymers, Inc.
    Inventors: Raymond S. Bregante, Tony Shaffer, K. Scott Mellen, Richard J. Ross
  • USE OF DIVERSE MATERIALS IN AIR-CAVITY PACKAGING OF ELECTRONIC DEVICES
    Publication number: 20030013234
    Abstract: Semiconductor circuit devices (dies) are incorporated into moisture-impenetrable electronic packages by forming enclosures around the die in three separate parts—base, sidewalls, and lid. The die is first soldered or otherwise bonded to the base, followed by attachment of the sidewalls to the base, and finally the lid to the sidewalls. For procedures involving a heat-conductive base and a high soldering temperature, the die can be secured to the base at the high soldering temperature, followed by application of the sidewalls to the base at a significantly lower temperature, avoiding potential high-temperature damage to the sidewalls. Plastic sidewalls which would otherwise deteriorate or become distorted upon exposure to the high soldering temperature can thus be used.
    Type: Application
    Filed: July 12, 2001
    Publication date: January 16, 2003
    Applicant: RJR Polymers, Inc.
    Inventors: Raymond S. Bregante, Tony Shaffer, K. Scott Mellen, Richard J. Ross