Patents by Inventor Raymond W. Moore, Jr.

Raymond W. Moore, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5142443
    Abstract: A mounting arrangement for electronic circuit chips in which at least one chip is mounted upon an appropriately electrically insulating chip plate. A connector board is mounted on top of the chip plate to electrically connect the chip with a cable allowing signals to be passed to and from the chip. The chip plate is mounted for good thermal conductivity to a refrigerator cold head. A plate formed of a material with good heat conductitivity properties may be interposed between the chip plate and the cold head. This plate may include an element, such as a spring biased piston, which contacts the chip to allow heat transfer by conduction. The refrigerator cold head forms the upper surface of the expansion space in a Stirling-cycle cryogenic cooling engine. To reduce power requirements, the elements are insulated from contact with the atmosphere.
    Type: Grant
    Filed: April 29, 1991
    Date of Patent: August 25, 1992
    Assignee: Koch Process Systems, Inc.
    Inventor: Raymond W. Moore, Jr.