Abstract: A fault resilient airborne network includes a plurality of aircraft system components installed within an aircraft and at least one agent in communication with the plurality of aircraft system components during in-flight operation of the aircraft. The at least one agent is configured to monitor an aircraft system component for a fault, observe a fault within the aircraft system component, and provide reconfiguration instructions to the aircraft system component in response to the observed fault. The at least one agent is further configured to predict a life expectancy of the aircraft system component using machine learning models while monitoring the aircraft system component for a fault, and provide reconfiguration instructions to the aircraft system component when the life expectancy of the aircraft system component meets a threshold. The reconfiguration instructions are configured to cause an adjustment in at least some of the plurality of aircraft system components.

Abstract: A printed circuit board (PCB) module may include a PCB with at least one internal PCB element and at least one external PCB element, a shielding layer fabricated from a tunable metamaterial absorber, and a structure housing the PCB. The at least one internal PCB element may be embedded between adjacent layers of the PCB. The at least one external PCB element may be coupled to an exterior surface of the PCB. The shielding layer may be tuned in response to the at least one measurement of the EMI emission and a determination of a frequency of the EMI emission from the at least one measurement. The tuning of the shielding layer may include adjusting a plurality of fins within a plurality of elements of the metamaterial absorber to absorb at least a portion of the EMI emission.

Abstract: A printed circuit board (PCB) module may include a PCB with at least one internal PCB element and at least one external PCB element, a shielding layer fabricated from a tunable metamaterial absorber, and a structure housing the PCB. The at least one internal PCB element may be embedded between adjacent layers of the PCB. The at least one external PCB element may be coupled to an exterior surface of the PCB. The shielding layer may be tuned in response to the at least one measurement of the EMI emission and a determination of a frequency of the EMI emission from the at least one measurement. The tuning of the shielding layer may include adjusting a plurality of fins within a plurality of elements of the metamaterial absorber to absorb at least a portion of the EMI emission.