Patents by Inventor Raymond Yi

Raymond Yi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Component carrier with protruding thermally conductive tongue and corresponding method of manufacturing
    Patent number: 11672076
    Abstract: A method of manufacturing a component carrier includes (i) forming a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; (ii) assembling a component to the stack; and (iii) forming a thermally conductive tongue having an embedded portion embedded in the stack and having an exposed portion protruding beyond the stack, where a first width of the tongue in the embedded portion is different from a second width of the tongue in the exposed portion. A corresponding component carrier includes analogous features.
    Type: Grant
    Filed: July 22, 2021
    Date of Patent: June 6, 2023
    Assignee: AT&SAustria Technologie & Systemtechnik AG
    Inventors: Naoto Yokoi, Raymond Yi, Sabine Liebfahrt, Christian Vockenberger, Ferdinand Lutschounig, Bernhard Reitmaier
  • Component Carrier With Protruding Thermally Conductive Tongue and Corresponding Method of Manufacturing
    Publication number: 20220030697
    Abstract: A method of manufacturing a component carrier includes (i) forming a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; (ii) assembling a component to the stack; and (iii) forming a thermally conductive tongue having an embedded portion embedded in the stack and having an exposed portion protruding beyond the stack, where a first width of the tongue in the embedded portion is different from a second width of the tongue in the exposed portion. A corresponding component carrier includes analogous features.
    Type: Application
    Filed: July 22, 2021
    Publication date: January 27, 2022
    Inventors: Naoto Yokoi, Raymond Yi, Sabine Liebfahrt, Christian Vockenberger, Ferdinand Lutschounig, Bernhard Reitmaier