Patents by Inventor Rayyan Bin Fairuz

Rayyan Bin Fairuz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230139725
    Abstract: A power module includes a first shell, a second shell, a circuit board assembly, and a heat dissipation encapsulation. The second shell is closed relative to the first shell and forms an accommodating space together with the first shell. The circuit board assembly is disposed in the accommodating space, and includes a circuit board body, a plurality of power components disposed on the circuit board body, and a plurality of electrical connectors electrically connected to the circuit board body. The electrical connectors are exposed from the first shell. The heat dissipation encapsulation is filled in the accommodating space and covers the circuit board assembly.
    Type: Application
    Filed: April 18, 2022
    Publication date: May 4, 2023
    Applicant: Lite-On Singapore Pte Ltd
    Inventors: Yijun Pan, Yingqian Zhang, Rayyan Bin Fairuz