Abstract: An apparatus comprising a transconductance control circuit, a boost control circuit, a current computation circuit and an oscillator circuit. The transconductance control circuit may be configured to generate a current control signal in response to (i) a voltage control signal and (ii) a plurality of range control signals. The boost control circuit may be configured to generate a current boost signal in response to a reference current signal and an enable signal. The current computation circuit may be configured to generate a first control signal and a second control signal in response to the current boost signal and the current control signal. The oscillator circuit may be configured to generate an output signal oscillating at a particular frequency in response to the first control signal and the second control signal.

Abstract: An apparatus comprising a transconductance control circuit, a boost control circuit, a current computation circuit and an oscillator circuit. The transconductance control circuit may be configured to generate a current control signal in response to (i) a voltage control signal and (ii) a plurality of range control signals. The boost control circuit may be configured to generate a current boost signal in response to a reference current signal and an enable signal. The current computation circuit may be configured to generate a first control signal and a second control signal in response to the current boost signal and the current control signal. The oscillator circuit may be configured to generate an output signal oscillating at a particular frequency in response to the first control signal and the second control signal.

Abstract: A method and apparatus for compensating for tunneling leakage current through a first capacitor includes: an operational amplifier, connected in a negative feedback configuration; a first compensation transistor; a second compensation transistor; and a compensation capacitor. The compensation capacitor is chosen so that the ratio of the area of the compensation capacitor divided by the area of the first capacitor is an area ratio “AR”. The operational amplifier sets the gate voltage of the compensation capacitor to be the same as the gate voltage of the first capacitor. The ratio of the size of the second compensation transistor divided by the size of the second compensation transistor is also the area ration “AR”.

Abstract: There is provided a new polysilicon fuse structure for implementation within integrated circuit devices so as to permit programming of the same. The polysilicon fuse structure includes a first electrical contact region, a second electrical contact region, and multiple fuse regions interconnected between the first electrical contact region and the second electrical contact region. The multiple fuse regions are formed of a plurality of strips, each being of a different width and/or length, which are disposed in a spaced-apart relationship so as to form a small opening between adjacent strips. A number of the plurality of strips is selectively blown when a predetermined amount of current is passed from one of the first and second electrical contact regions through the plurality of strips to the other one of the first and second electrical contact regions so to limit the current passing to an integrated circuit device connected thereto during normal operating conditions.

Abstract: An output buffer interfaces a digital system having devices designed for low operating voltages to an output coupled to an external system having higher operating voltages. The output buffer drives the output to one of a high output voltage and a low output voltage while limiting voltage across terminals of devices within the output buffer. The output buffer includes a pull-up stack of a first plurality of devices, coupled between a high power supply and the output, which turn on when the output is driven to the high output voltage and which turn off when the output is driven to the low output voltage. The voltage difference between the output and the high power supply is distributed across the first plurality of devices when the output is driven to the low output voltage.

Abstract: A level shifter interfaces a digital system having devices designed for low operating voltages to an external system having higher operating voltages. The level shifter is comprised of two level shifting stages. Each level shifting stage includes a pull-up stack of a plurality of pull-up devices, coupled between a high power supply and a coupling node, which turn on when the coupling node is driven to a high shifted voltage, which is substantially the voltage at the high power supply, and which turn off when the coupling node is driven to a low shifted voltage, which is substantially the voltage at a low power supply. Each level shifting stage further includes a pull-down stack of a plurality of pull-down devices, coupled between the low power supply and the coupling node, which turn on when the coupling node is driven to the low shifted voltage and which turn off when the coupling node is driven to the high shifted voltage.

Abstract: An improved gate oxide protected level shifter is provided which has a higher speed of operation than is traditionally available. The level shifter includes a first capacitor coupled between a first output terminal and the input of an inverter and a second capacitor coupled between a first node and the output of the inverter. As a result, the speed of the transitions at the gates of the pair of cross-coupled P-channel MOS transistors is increased several times.

Abstract: A reference voltage generation circuit is provided for use in gate oxide protected circuits for generating an NMOS reference voltage and PMOS reference voltage in which the NMOS reference voltage is independent of an I/O buffer power supply potential and in which the PMOS reference voltage tracks the supply voltage. The reference voltage generation circuit includes a bandgap voltage reference circuit, a first operational amplifier, a voltage divider and a second operational amplifier. In one embodiment, the NMOS reference voltage is approximately +2.2 volts and is referenced with respect to ground. The PMOS reference voltage is approximately +1.1 volts and referenced with respect to the I/O buffer power supply voltage and the NMOS reference voltage.

Abstract: An oxide protection circuit prevents failure of the MOS transistors in a digital device. A voltage difference at a gate oxide of a digital device does not exceed a breakdown voltage magnitude. The gate oxide protection circuit includes a plurality of transistors which turn OFF or ON when a node reaches a predetermined voltage of V.sub.refp +V.sub.t or V.sub.refn -V.sub.t, where V.sub.refp and V.sub.refn are reference applied at a gate of a PMOS or an NMOS transistor, and V.sub.t equals a threshold voltage of the MOS transistor.