Patents by Inventor Reah MIYARA

Reah MIYARA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230334372
    Abstract: Techniques for optimizing a machine learning model. The techniques may include obtaining multiple predictions from a machine learning model, the predictions being based on at least one input feature vector, each input feature vector having one or more vector values; creating at least one slice of the predictions based on at least one vector value; determining a sensitive bias metric for the slice based on a sensitive group; determining a base metric for the slice based on a base group; determining a parity metric for the slice based on a ratio of the sensitive bias metric and the base metric; and optimizing the machine learning model based on the parity metric.
    Type: Application
    Filed: April 13, 2023
    Publication date: October 19, 2023
    Applicant: ARIZE AI, INC.
    Inventors: Jason LOPATECKI, Reah MIYARA, Tsion BEHAILU, Aparna DHINAKARAN