Patents by Inventor Real Tetreault
Real Tetreault has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6988882Abstract: A method, mold and apparatus for encapsulating and underfilling an integrated circuit chip assembly. The mold has a first portion and a second portion with the first portion having first and second cavities and at least one channel interconnecting the first and second cavities. The first cavity is adapted to enclose the integrated circuit chip on the substrate. A clamping force is applied to the first and second portions of the mold to clamp the substrate between them with the integrated circuit chip located in the first cavity. Vents exhaust air from the first cavity. Encapsulant is injected into the first cavity of the first portion at a location in the first portion remote from the point of connection of the channel such that encapsulant flows around and underneath the integrated circuit chip and through the channel into the second cavity to thereby underfill and encapsulate the integrated circuit assembly.Type: GrantFiled: August 22, 2005Date of Patent: January 24, 2006Assignee: International Business Machines CorporationInventors: Marie-France Boyaud, Catherine Dufort, Marie-Claude Paquet, Real Tetreault
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Publication number: 20050275091Abstract: A method, mold and apparatus for encapsulating and underfilling an integrated circuit chip assembly. The mold has a first portion and a second portion with the first portion having first and second cavities and at least one channel interconnecting said first and second cavities. The first cavity is adapted to enclose said integrated circuit chip on said substrate. A clamping force is applied to the first and second portions of the mold to clamp the substrate between them with the integrated circuit chip located in the first cavity. Vents exhaust air from the first cavity. Encapsulant is injected into the first cavity of the first portion at a location in the first portion remote from the point of connection of the channel such that encapsulant flows around and underneath the integrated circuit chip and through the channel into the second cavity to thereby underfill and encapsulate the integrated circuit assembly.Type: ApplicationFiled: August 22, 2005Publication date: December 15, 2005Applicant: International Business Machines CorporationInventors: Marie-France Boyaud, Catherine Dufort, Marie-Claude Paquet, Real Tetreault
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Patent number: 6956296Abstract: A method, mold and apparatus for encapsulating and underfilling an integrated circuit chip assembly. The mold has a first portion and a second portion with the first portion having first and second cavities and at least one channel interconnecting said first and second cavities. The first cavity is adapted to enclose said integrated circuit chip on said substrate. A clamping force is applied to the first and second portions of the mold to clamp the substrate between them with the integrated circuit chip located in the first cavity. Vents exhaust air from the first cavity. Encapsulant is injected into the first cavity of the first portion at a location in the first portion remote from the point of connection of the channel such that encapsulant flows around and underneath the integrated circuit chip and through the channel into the second cavity to thereby underfill and encapsulate the integrated circuit assembly.Type: GrantFiled: October 8, 2003Date of Patent: October 18, 2005Assignee: International Business Machines CorporationInventors: Marie-France Boyaud, Catherine Dufort, Marie-Claude Paquet, Real Tetreault
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Patent number: 6822875Abstract: A heat sink for a transceiver optoelectronic module including dual direct heat paths and a structure which encloses a number of chips having a central web which electrically isolates transmitter and receiver chips from each other. A retainer for an optical coupler having a port into which epoxy is poured. An overmolded base for an optoelectronic module having epoxy flow controller members built thereon. Assembly methods for an optoelectronic module including gap setting and variation of a TAB bonding process.Type: GrantFiled: October 24, 2002Date of Patent: November 23, 2004Assignee: International Business Machines CorporationInventors: Benson Chan, Paul Francis Fortier, Ladd William Freitag, Gary T. Galli, Francois Guindon, Glen Walden Johnson, Martial Letourneau, John H. Sherman, Real Tetreault
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Publication number: 20040071805Abstract: A method, mold and apparatus for encapsulating and underfilling an integrated circuit chip assembly. The mold has a first portion and a second portion with the first portion having first and second cavities and at least one channel interconnecting said first and second cavities. The first cavity is adapted to enclose said integrated circuit chip on said substrate. A clamping force is applied to the first and second portions of the mold to clamp the substrate between them with the integrated circuit chip located in the first cavity. Vents exhaust air from the first cavity. Encapsulant is injected into the first cavity of the first portion at a location in the first portion remote from the point of connection of the channel such that encapsulant flows around and underneath the integrated circuit chip and through the channel into the second cavity to thereby underfill and encapsulate the integrated circuit assembly.Type: ApplicationFiled: October 8, 2003Publication date: April 15, 2004Applicant: International Business Machines CorporationInventors: Marie-France Boyaud, Catherine Dufort, Marie-Claude Paquet, Real Tetreault
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Patent number: 6656773Abstract: There is provided a method, mold and apparatus for encapsulating and underfilling an integrated circuit chip assembly including an integrated circuit chip mounted on a substrate in a standoff relationship. The mold has a first portion and a second portion with the first portion having first and second cavities and at least one channel interconnecting said first and second cavities. The first cavity is adapted to enclose said integrated circuit chip on said substrate. Means, e.g., a clamp, applies a clamping force to the first and the second portions of the mold to clamp the substrate between the first and second portions with the integrated circuit chip located in the first cavity. Vent means exhausts air from the first cavity.Type: GrantFiled: June 12, 2002Date of Patent: December 2, 2003Assignee: International Business Machines CorporationInventors: Marie-France Boyaud, Catherine Dufort, Marie-Claude Paquet, Real Tetreault
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Patent number: 6547452Abstract: Alignment systems for optoelectronic modules with overmolded chip carriers include drilled or milled substrate corners for engaging dowel pins to precisely align the substrate in a mold for molding an overmold frame on the substrate. The overmold frame includes slot and trilobe holes for receiving retainer posts to precisely align a retainer assembly on the overmold frame. Cooperating standoff pads on the overmold frame and on the retainer assembly stabilize the assembly of these components and provide a precise gap for receiving an adhesive to permanently attach these two components. The retainer assembly carries optoelectronic components that include a flexible circuit, and a distal end portion of this flexible circuit and walls of a receiving cavity in the overmold frame have cooperating features for precisely aligning distal electrical leads of the flexible circuit with an array of electrical pads on the substrate.Type: GrantFiled: May 11, 2000Date of Patent: April 15, 2003Assignee: International Business Machines CorporationInventors: Benson Chan, Paul F. Fortier, Francois M. Guindon, Glen W. Johnson, Martial A. Letourneau, John H. Sherman, Real Tetreault
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Publication number: 20030059176Abstract: A heat sink for a transceiver optoelectronic module including dual direct heat paths and a structure which encloses a number of chips having a central web which electrically isolates transmitter and receiver chips from each other. A retainer for an optical coupler having a port into which epoxy is poured. An overmolded base for an optoelectronic module having epoxy flow controller members built thereon. Assembly methods for an optoelectronic module including gap setting and variation of a TAB bonding process.Type: ApplicationFiled: October 24, 2002Publication date: March 27, 2003Applicant: International Business Machines CorporationInventors: Benson Chan, Paul Francis Fortier, Ladd William Freitag, Gary T. Galli, Francois Guindon, Glen Walden Johnson, Martial Letourneau, John H. Sherman, Real Tetreault
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Patent number: 6508595Abstract: A heat sink for a transceiver optoelectronic module including dual direct heat paths and structure which encloses a number of chips having a central web which electrically isolates transmitter and receiver chips from each other. A retainer for an optical coupler having a port into which epoxy is poured. An overmolded base for an optoelectronic module having epoxy flow controller members built thereon. Assembly methods for an optoelectronic module including gap setting and variation of a TAB bonding process.Type: GrantFiled: May 11, 2000Date of Patent: January 21, 2003Assignee: International Business Machines CorporationInventors: Benson Chan, Paul Francis Fortier, Ladd William Freitag, Gary T. Galli, Francois Guindon, Glen Walden Johnson, Martial Letourneau, John H. Sherman, Real Tetreault
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Publication number: 20020192876Abstract: There is provided a method, mold and apparatus for encapsulating and underfilling an integrated circuit chip assembly including an integrated circuit chip mounted on a substrate in a standoff relationship. The mold has a first portion and a second portion with the first portion having first and second cavities and at least one channel interconnecting said first and second cavities. The first cavity is adapted to enclose said integrated circuit chip on said substrate. Means, e.g., a clamp, applies a clamping force to the first and the second portions of the mold to clamp the substrate between the first and second portions with the integrated circuit chip located in the first cavity. Vent means exhausts air from the first cavity.Type: ApplicationFiled: June 12, 2002Publication date: December 19, 2002Inventors: Marie-France Boyaud, Catherine Dufort, Marie-Claude Paquet, Real Tetreault
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Patent number: 6309575Abstract: A method and resulting integrated circuit package is disclosed for encapsulating integrated circuit chips using transfer molding techniques in a form known as cavity packages. Each chip is positioned within a cavity surrounded by a laminate or printed wiring board which provides an array of contacts. The contacts provide for connections to an external circuit board/card and the contacts are also indirectly connected internally to the chip. The cavity, chip and some of the laminate, contacts and interconnections are on the same side of the carrier. Liquid plastic is forced into the cavity via a runner in a mold through a gate in the bottom of the carrier in order to encapsulate all of these components.Type: GrantFiled: April 12, 1999Date of Patent: October 30, 2001Assignee: International Business Machines CorporationInventors: Lynda Boutin, Martial A. Letourneau, Real Tetreault
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Patent number: 5939778Abstract: A method and resulting integrated circuit package is disclosed for encapsulating integrated circuit chips using transfer molding techniques in a form known as cavity packages. Each chip is positioned within a cavity surrounded by a laminate or printed wiring board which provides an array of contacts. The contacts provide for connections to an external circuit board/card and the contacts are also indirectly connected internally to the chip. The cavity, chip and some of the laminate, contacts and interconnections are on the same side of the carrier. Liquid plastic is forced into the cavity via a runner in a mold through a gate in the bottom of the carrier in order to encapsulate all of these components.Type: GrantFiled: July 8, 1997Date of Patent: August 17, 1999Assignee: International Business Machines CorporationInventors: Lynda Boutin, Martial A. Letourneau, Real Tetreault