Patents by Inventor Rebecca S. Northey

Rebecca S. Northey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device comprising electrically stable copper filled electrically conductive adhesive
    Patent number: 8293141
    Abstract: An electronic device including electronic circuit structures formed with an electrically conductive adhesive (ECA) with low and stable contact resistance including at least one melt-processable reactive resin, at least one reactive diluent, at least one rheological additive, at least one curing agent, at least one organic acid catalyst, and copper particles. The ECA is useful for filling vias, and bonding together components of electronic circuit structures.
    Type: Grant
    Filed: February 16, 2008
    Date of Patent: October 23, 2012
    Assignee: International Business Machines Corporation
    Inventors: Michael Gaynes, Jeffrey D. Gelorme, Luis J. Matienzo, Rebecca S. Northey, Michael B. Vincent
  • Electrically stable copper filled electrically conductive adhesive
    Patent number: 7763188
    Abstract: An electrically conductive adhesive (ECA) with low and stable contact resistance includes at least one melt-processable reactive resin, at least one reactive diluent, at least one rheological additive, copper particles, at least one curing agent and at least one organic acid catalyst. The ECA is useful for filling vias, and bonding together components of electronic circuit structures.
    Type: Grant
    Filed: March 4, 2005
    Date of Patent: July 27, 2010
    Assignee: International Business Machines Corporation
    Inventors: Michael Gaynes, Jeffrey D. Gelorme, Luis J. Matienzo, Rebecca S. Northey, Michael B. Vincent
  • ELECTRICALLY STABLE COPPER FILLED ELECTRICALLY CONDUCTIVE ADHESIVE
    Publication number: 20080230262
    Abstract: An electronic device including electronic circuit structures formed with an electrically conductive adhesive (ECA) with low and stable contact resistance including at least one melt-processable reactive resin, at least one reactive diluent, at least one rheological additive, at least one curing agent, at least one organic acid catalyst, and copper particles. The ECA is useful for filling vias, and bonding together components of electronic circuit structures.
    Type: Application
    Filed: February 16, 2008
    Publication date: September 25, 2008
    Applicant: Internationa Business Machines Corporation
    Inventors: Michael Gaynes, Jeffrey D. Gelorme, Luis J. Matienzo, Rebecca S. Northey, Michael B. Vincent
  • PROCESS FOR PREPARING AN ELECTRICALLY STABLE COPPER FILLED ELECTRICALLY CONDUCTIVE ADHESIVE
    Publication number: 20080223604
    Abstract: A process for preparing an electrically conductive adhesive (ECA) with low and stable contact resistance by mixing at least one melt-processable reactive resin, at least one reactive diluent, at least one rheological additive, at least one curing agent, at least one organic acid catalyst, and copper particles. The ECA is useful for filling vias, and bonding together components of electronic circuit structures.
    Type: Application
    Filed: February 16, 2008
    Publication date: September 18, 2008
    Applicant: International Business Machines Corporation
    Inventors: Michael Gaynes, Jeffrey D. Gelorme, Luis J. Matienzo, Rebecca S. Northey, Michael B. Vincent