Patents by Inventor Rebecca Tishkoff

Rebecca Tishkoff has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer applied fluxing and underfill material, and layered electronic assemblies manufactured therewith
    Patent number: 7109061
    Abstract: A flip-chip type integrated circuit chip including a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical interconnection with a carrier substrate is provided. The chip die includes a fluxing agent disposed on a surface of the electrical contacts, and a curable thermosetting underfill composition distinct from the fluxing agent and disposed in a flowable form over the chip die. Upon mating of the chip die with the substrate and heating, the electrical contacts flow and the thermosetting underfill composition cures, thus adhering the chip die to the substrate, forming a circuit assembly.
    Type: Grant
    Filed: November 6, 2001
    Date of Patent: September 19, 2006
    Assignee: Henkel Corporation
    Inventors: Lawrence N. Crane, Mark M. Konarski, Erin K. Yaeger, Afranio Torres-Filho, J. Paul Krug, Rebecca Tishkoff
  • Wafer applied fluxing and underfill material, and layered electronic assemblies manufactured therewith
    Publication number: 20020089067
    Abstract: A flip-chip type integrated circuit chip including a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical interconnection with a carrier substrate is provided. The chip die includes a fluxing agent disposed on a surface of the electrical contacts, and a curable thermosetting underfill composition distinct from the fluxing agent and disposed in a flowable form over the chip die. Upon mating of the chip die with the substrate and heating, the electrical contacts flow and the thermosetting underfill composition cures, thus adhering the chip die to the substrate, forming a circuit assembly.
    Type: Application
    Filed: November 6, 2001
    Publication date: July 11, 2002
    Applicant: Loctite Corporation
    Inventors: Lawrence N. Crane, Mark M. Konarski, Erin K. Yaeger, Afranio Torres-Filho, J. Paul Krug, Rebecca Tishkoff